Dell PowerEdge R650 EMC Technical Specifications - Page 18

Thermal restrictions matrix for air cooling Table 22. Label references Label references STD HPR HSK LP FH DW BPS Standard High Performance Heat sink Low Profile (Riser) Full Height (Riser) Double Wide (Xilinx FPGA accelerator) Intel Persistent Memory 200 series (BPS) Table 23. Cooling fan matrix for air cooling Configurati on 4 x 3.5-inch 8 x 2.5-inch Rear storage CPU TDP 3 LP/ 2 FH Rear 2 x 2.5-inch Rear 2 x 2.5-inch NVMe 3 LP/ 2 FH 10 x 2.5-inch SAS 3 LP/ 2 FH Rear 2 x 2.5-inch SAS 10 x 2.5-inch NVMe 3 LP/ 2 FH Rear 2 x 2.5-inch NVMe 105 W / 120 W 135 W / 140 STD W fan 150 W 165 W 185 W / 195 W 205 W 225 W / 230 W / 235 W 240 W / 250 W 265 W / 270 W HPR SLVR fan HPR SLVR fan Not supported STD fan HPR SLVR fan HPR Gold fan HPR SLVR fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan Not supported Table 24. Processor and heat sink matrix Heat sink STD HSK T-type HSK T-type HSK Processor TDP ≤ 165 W Processor 1 > 165 W Processor 2 > 165 W Table 25. T4 GPU support restriction Slots 2.5-inch x 10 Rear 3 x LP Config 2 x FH Slot 1 Supported Supported 2.5-inch x 8 3 x LP Supported 2 x FH Supported 3.5-inch x 4 3 x LP 2 x FH Supported Supported 18 Technical specifications