Dell PowerEdge R750 EMC Technical Specifications - Page 15

Thermal restriction matrix Table 20. Label reference Label STD HPR HSK LP FH DW BPS DPC Description Standard High performance Heat sink Low profile Full height Double Wide Intel Persistent Memory 200 series (BPS) DIMM per channel Table 21. Processor and heat sink matrix Heat sink 1U STD HSK T-Type HSK 2U HPR HSK Processor TDP ≤ 165 W (for non-GPU) For all TDP with GPU, and 256 GB LRDIMM configurations >165 W (for non-GPU configurations) Table 22. Thermal restriction matrix with ≤64 GB RDIMM (Non-GPU) Configuration 8 x 2.5inch NVMe 16 x 2.5inch SAS/ SATA 16 x 2.5inch NVMe 24 x 2.5-inch SAS/ SATA 16 x 2.5inch SAS + 8 x 2.5inch NVMe 24 x 2.5inch NVMe Rear storage No Rear Drives No Rear Drives No Rear Drives No Rear Drive s 2 x Rear 2.5inch, no rear fan 4 x Rear 2.5inch with fan No No Rear Rear Drives Drives CPU TDP/ cTDP 105 W 120 W 125 W 135 W 140 W STD fan HPR SLVR fan HPR GOLD fan 150 W STD fan 165 W 185 W 195 W 205 W 225 W HPR GOLD fan HPR SLVR fan HPR GOLD fan 12 x 3.5-inch SAS/ SATA No Rear Drives 2 x Rear2 .5inch, no rear fan 4 x Rear 2.5inch with fan HPR SLVR fan HPR SLVR fan Ambie nt tempe rature 35°C 35°C 35°C 35°C 35°C 35°C 35°C 30°C 35°C 35°C 35°C Technical specifications 15