Dell PowerEdge R750 EMC Technical Specifications - Page 20

Table 26. Thermal restriction matrix with BPS + 256 GB LRDIMMNon-GPU continued

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Table 26. Thermal restriction matrix with BPS + 256 GB LRDIMM(Non-GPU) (continued) Configuration 8 x 2.5inch NVMe 16 x 2.5inch SAS/ SATA 16 x 2.5inch NVMe 24 x 2.5-inch SAS/ SATA 16 x 2.5inch SAS + 8 x 2.5inch NVMe 24 x 2.5inch NVMe 12 x 3.5-inch SAS/ SATA Rear storage No Rear Drives No No Rear Rear Drives Drives No Rear Drive s 2 x Rear 2.5inch, no rear fan 4 x Rear 2.5inch with fan No Rear Drives No Rear Drives No 2 x Rear Rear Drives 2.5- inch, no rear fan 4 x Rear 2.5inch with fan 225 W 230 W 235 W 240 W 250 W 265 W 270 W Ambie nt tempe rature 30°C NOTE: For all CPU TDP (105 W- 270 W) request HPR GOLD fan, T-Type HSK and processor HSK blank for 2.5-inch configurations. Table 27. Thermal restriction with ≤128 GB DIMM (GPU) Configu ration (Front storage ) Fan type CPU TDP/ cTDP A100 (80G) A100 GPU (Ambient temperature) A40 (max 2) A30 A10 8 x 2.5inch NVMe HPR SLVR fan 270 W 35°C 35°C 35°C 35°C 35°C 16 x 2.5inch SAS HPR GOLD fan 270 W 35°C 35°C 35°C 35°C 35°C 16 x 2.5inch NVMe HPR GOLD fan 270 W 35°C 35°C 35°C 35°C 35°C 24 x 2.5inch SAS HPR GOLD fan 270 W 35°C 35°C 35°C 35°C 35°C 16 x 2.5inch SAS + 8 x 2.5inch NVMe HPR GOLD fan 270 W 35°C 35°C 35°C 35°C 35°C M10 (max T4 (max 2) 6) 35°C 30°C 35°C 30°C 35°C 30°C 35°C 30°C 35°C 30°C 20 Technical specifications

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Table 26. Thermal restriction matrix with BPS + 256 GB LRDIMM(Non-GPU) (continued)
Configuration
8 x 2.5-
inch
NVMe
16 x
2.5-
inch
SAS/
SATA
16 x
2.5-
inch
NVMe
24 x 2.5-inch SAS/
SATA
16 x
2.5-
inch
SAS +
8 x
2.5-
inch
NVMe
24 x
2.5-
inch
NVMe
12 x 3.5-inch SAS/
SATA
Ambie
nt
tempe
rature
Rear storage
No Rear
Drives
No
Rear
Drives
No
Rear
Drives
No
Rear
Drive
s
2 x
Rear
2.5-
inch,
no
rear
fan
4 x
Rear
2.5-
inch
with
fan
No
Rear
Drives
No
Rear
Drives
No
Rear
Drives
2 x
Rear
2.5-
inch,
no
rear
fan
4 x
Rear
2.5-
inch
with
fan
225 W
230 W
235 W
240 W
250 W
265 W
270 W
30°C
NOTE:
For all CPU TDP (105 W- 270 W) request HPR GOLD fan, T-Type HSK and processor HSK blank for 2.5-inch
configurations.
Table 27. Thermal restriction with ≤128 GB DIMM (GPU)
Configu
ration
(Front
storage
)
Fan
type
CPU TDP/
cTDP
GPU (Ambient temperature)
A100 (80G)
A100
A40 (max
2)
A30
A10
M10 (max
2)
T4 (max
6)
8 x 2.5-
inch
NVMe
HPR
SLVR
fan
270 W
35°C
35°C
35°C
35°C
35°C
35°C
30°C
16 x
2.5-
inch
SAS
HPR
GOLD
fan
270 W
35°C
35°C
35°C
35°C
35°C
35°C
30°C
16 x
2.5-
inch
NVMe
HPR
GOLD
fan
270 W
35°C
35°C
35°C
35°C
35°C
35°C
30°C
24 x
2.5-
inch
SAS
HPR
GOLD
fan
270 W
35°C
35°C
35°C
35°C
35°C
35°C
30°C
16 x
2.5-
inch
SAS + 8
x 2.5-
inch
NVMe
HPR
GOLD
fan
270 W
35°C
35°C
35°C
35°C
35°C
35°C
30°C
20
Technical specifications