Dell PowerEdge R750 EMC Technical Specifications - Page 23

Table 29. Thermal restriction matrix for liquid cooling systems (continued) Configuration 8 x 2.5inch NVMe 16 x 2.5- 16 x 2.5- 24 x 2.5- 16 x 2.5-inch + 24 x 2.5- inch SAS/ inch NVMe inch SAS/ 8 x 2.5-inch inch NVMe SATA SATA NVMe Rear storage No Rear No Rear Drives Drives No Rear Drives No Rear No Rear Drives Drives No Rear Drives T4 (max 6) HPR GOLD fan4 GPU + BPS + ≤128 GB DIMM GPU + BPS + 256 GB LRDIMM M10 (max 2) A40 (max 2) A100 (max 2) T4 (max 6) M10 (max 2) A40 (max 2) A100 (max 2) T4 (max 6) M10 (max 2) A40 (max 2) Not supported HPR GOLD fan4 HPR GOLD fan4 Not supported 12 x 3.5inch SAS/ SATA No Rear Drives Not supported Not supported NOTE: ¹ for ASHRAE A2 category (35°C), ² for ASHRAE A3 category (40°C), ³ for ASHRAE A4 (45°C) and 4 for ASHRAE A2 category with 30°C ambient temperature restriction. NOTE: Liquid cooling is not supported on rear drive configurations. NOTE: DIMM blank is not required for liquid cooling configurations. NOTE: All the configuration are required to have six fans installed. Other restriction for liquid cooling configurations ● 25 Gb and above PCIe or OCP cards require high temperature (85°C) active optics cable. Shroud, heat sink, and riser cage restriction Table 30. Restrictions with shroud, heat sink, and riser cage PCIe Form factor Fan card type Processor heat sink GPU FL HL Configuration dependency T-type (1U-EXT) Non-GPU FL Shroud GPU shroud HL 1U-STD or 2U-HPR STD shroud Riser cage long short long short long short Technical specifications 23