Dell PowerEdge R750 EMC Technical Specifications - Page 18

Table 24. Thermal restriction matrix with 256 GB LRDIMM Non-GPU continued, Table 25. Thermal

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Table 24. Thermal restriction matrix with 256 GB LRDIMM (Non-GPU) (continued) Configuration 8 x 2.5inch NVMe 16 x 2.5inch SAS/ SATA 16 x 24 x 2.5-inch SAS/ 2.5- SATA inch NVMe 16 x 2.5inch SAS + 8 x 2.5inch NVMe 24 x 2.5inch NVMe 12 x 3.5-inch SAS/ SATA Rear storage No Rear Drives No Rear Drives No Rear Drives No Rear Drive s 2 x Rear 2.5inch, no rear fan 4 x Rear 2.5inch with fan No Rear Drives No Rear Drives No 2 x Rear Rear2 Drives .5- inch, no rear fan 4 x Rear 2.5inch with fan 195 W 205 W 225 W 230 W 235 W 240 W 250 W 265 W 270 W Ambie nt tempe rature 30°C 30°C 30°C 30°C 30°C 30°C 30°C 30°C 30°C NOTE: For all CPU TDP (105 W- 270 W) request HPR GOLD fan, T-Type HSK and processor HSK blank for 2.5-inch configurations. NOTE: For CPU TDP >165 W and riser configuration 1, 2, 3, or 4 supports maximum of four PCIe cards in Riser 1 or 2. This restriction is applicable for 8 x 2.5-inch NVMe, 16 x 2.5-inch SAS/SATA and 16 x 2.5-inch NVMe system configurations. Table 25. Thermal restriction matrix with BPS + ≤128 GB DIMM (Non-GPU) Configuration 8 x 2.5inch NVMe 16 x 2.5inch SAS/ SATA 16 x 2.5inch NVMe 24 x 2.5-inch SAS/ SATA 16 x 2.5inch SAS + 8 x 2.5inch NVMe 24 x 2.5inch NVMe Rear storage No Rear Drives No Rear Drives No Rear Drives No Rear Drive s 2 x Rear 2.5inch, no rear fan 4 x Rear 2.5inch with fan No No Rear Rear Drives Drives CPU TDP/ cTDP 105 W 120 W 125 W 135 W HPR GOLD fan 140 W 150 W 165 W 12 x 3.5-inch SAS/ SATA No 2 x Rear Rear Drives 2.5- inch, no rear fan 4 x Rear 2.5inch with fan Not supported Ambie nt tempe rature 35°C 35°C 35°C 35°C 35°C 35°C 35°C 18 Technical specifications

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Table 24. Thermal restriction matrix with 256 GB LRDIMM (Non-GPU) (continued)
Configuration
8 x 2.5-
inch
NVMe
16 x
2.5-
inch
SAS/
SATA
16 x
2.5-
inch
NVMe
24 x 2.5-inch SAS/
SATA
16 x
2.5-
inch
SAS +
8 x
2.5-
inch
NVMe
24 x
2.5-
inch
NVMe
12 x 3.5-inch SAS/
SATA
Ambie
nt
tempe
rature
Rear storage
No Rear
Drives
No
Rear
Drives
No
Rear
Drives
No
Rear
Drive
s
2 x
Rear
2.5-
inch,
no
rear
fan
4 x
Rear
2.5-
inch
with
fan
No
Rear
Drives
No
Rear
Drives
No
Rear
Drives
2 x
Rear2
.5-
inch,
no
rear
fan
4 x
Rear
2.5-
inch
with
fan
195 W
30°C
205 W
30°C
225 W
30°C
230 W
30°C
235 W
30°C
240 W
30°C
250 W
30°C
265 W
30°C
270 W
30°C
NOTE:
For all CPU TDP (105 W- 270 W) request HPR GOLD fan, T-Type HSK and processor HSK blank for 2.5-inch
configurations.
NOTE:
For CPU TDP >165 W and riser configuration 1, 2, 3, or 4 supports maximum of four PCIe cards in Riser 1 or 2. This
restriction is applicable for 8 x 2.5-inch NVMe, 16 x 2.5-inch SAS/SATA and 16 x 2.5-inch NVMe system configurations.
Table 25. Thermal restriction matrix with BPS + ≤128 GB DIMM (Non-GPU)
Configuration
8 x 2.5-
inch
NVMe
16 x
2.5-
inch
SAS/
SATA
16 x
2.5-
inch
NVMe
24 x 2.5-inch SAS/
SATA
16 x
2.5-
inch
SAS +
8 x
2.5-
inch
NVMe
24 x
2.5-
inch
NVMe
12 x 3.5-inch SAS/
SATA
Ambie
nt
tempe
rature
Rear storage
No Rear
Drives
No
Rear
Drives
No
Rear
Drives
No
Rear
Drive
s
2 x
Rear
2.5-
inch,
no
rear
fan
4 x
Rear
2.5-
inch
with
fan
No
Rear
Drives
No
Rear
Drives
No
Rear
Drives
2 x
Rear
2.5-
inch,
no
rear
fan
4 x
Rear
2.5-
inch
with
fan
CPU
TDP/
cTDP
105 W
HPR GOLD fan
Not supported
35°C
120 W
35°C
125 W
35°C
135 W
35°C
140 W
35°C
150 W
35°C
165 W
35°C
18
Technical specifications