HP 1000-1100 HP 1000 Notebook PC and Compaq Presario CQ45 Notebook PC - Mainte - Page 99

services it, Thermal paste is used on the graphics subsystem chip

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● Thermal paste is used on the processor (1) and the heat sink section (2) that services it NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel processor and a graphics subsystem with discrete memory. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● Thermal paste is used on the graphics subsystem chip (3) and the heat sink section (4) that services it NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel processor and a graphics subsystem with UMA memory. Component replacement procedures 91

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●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
NOTE:
The following illustration shows the replacement thermal material locations on a computer
model equipped with an Intel processor and a graphics subsystem with discrete memory.
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
●
Thermal paste is used on the graphics subsystem chip
(3)
and the heat sink section
(4)
that
services it
NOTE:
The following illustration shows the replacement thermal material locations on a computer
model equipped with an Intel processor and a graphics subsystem with UMA memory.
Component replacement procedures
91