HP OMEN 15-dc2000 Maintenance and Service Guide - Page 67

and the system board components each time the heat sink is removed. Thermal paste is used

Page 67 highlights

1. Prepare the computer for disassembly (Preparation for disassembly on page 34). 2. Remove the base enclosure (see Base enclosure on page 34). 3. Remove the battery (see Battery on page 45). 4. Remove the hard drive (see Hard drive (HDD) on page 37). 5. Remove the solid-state drive (see Solid-state drive (SSD) on page 39). 6. Remove the power connector cable (see Power connector cable on page 50). 7. Remove the fans (see Fans on page 48). Remove the heat sink: 1. Remove the eight Phillips head screws (1) that secure the heat sink to the system board. 2. Remove the heat sink (2). NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Thermal paste is used on the processor (1) and (3) and the heat sink section (2) and (4) that services it. Component replacement procedures 57

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1.
Prepare the computer for disassembly (
Preparation for disassembly
on page
34
).
2.
Remove the base enclosure (see
Base enclosure
on page
34
).
3.
Remove the battery (see
Battery
on page
45
).
4.
Remove the hard drive (see
Hard drive (HDD)
on page
37
).
5.
Remove the solid-state drive (see
Solid-state drive (SSD)
on page
39
).
6.
Remove the power connector cable (see
Power connector cable
on page
50
).
7.
Remove the fans (see
Fans
on page
48
).
Remove the heat sink:
1.
Remove the eight Phillips head screws
(1)
that secure the heat sink to the system board.
2.
Remove the heat sink
(2)
.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink
and the system board components each time the heat sink is removed. Thermal paste is used on
the processor
(1)
and
(3)
and the heat sink section
(2)
and
(4)
that services it.
Component replacement procedures
57