HP Pavilion 14-al100 Maintenance and Service Guide - Page 59

TouchPad cable

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NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board each time the heat sink is removed. Thermal material is used on the processor (1) and the heat sink section (2) that services it. Thermal material is also used on the graphics subsystem chip (3) and the heat sink section (4) that services it. The following illustration shows the thermal material locations on a computer model equipped with a graphics subsystem with discrete memory. Thermal material is used on the processor (1) and the heat sink section (2) that services it. The following illustration shows the thermal material locations on a computer model equipped with a graphics subsystem with UMA memory. Reverse this procedure to install the heat sink. TouchPad cable Description TouchPad cable (includes double-sided adhesive) Spare part number 856203-001 Component replacement procedures 51

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NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board each time the heat sink is removed.
Thermal material is used on the processor
(1)
and the heat sink section
(2)
that services it. Thermal material is
also used on the graphics subsystem chip
(3)
and the heat sink section
(4)
that services it. The following
illustration shows the thermal material locations on a computer model equipped with a graphics subsystem with
discrete memory.
Thermal material is used on the processor
(1)
and the heat sink section
(2)
that services it. The following
illustration shows the thermal material locations on a computer model equipped with a graphics subsystem with
UMA memory.
Reverse this procedure to install the heat sink.
TouchPad cable
Description
Spare part number
TouchPad cable (includes double-sided adhesive)
856203-001
Component replacement procedures
51