HP Pavilion 14-bk100 Maintenance and Service Guide - Page 50

UMA graphics models, that secure

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● Thermal paste is used on the processor (1) and associated heat sink area (2), as well as the graphics chip (3) and associated heat sink area (4). NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink, processor, and system board spare part kits. 3. UMA graphics models: In the order indicated on the heat sink, remove the four screws (1) that secure the heat sink to the system board. 4. Remove the heat sink from the system board (2). 42 Chapter 5 Removal and replacement procedures for Authorized Service Provider parts

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●
Thermal paste is used on the processor
(1)
and associated heat sink area
(2)
, as well as the
graphics chip
(3)
and associated heat sink area
(4)
.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Replacement thermal material
is included with the heat sink, processor, and system board spare part kits.
3.
UMA graphics models:
In the order indicated on the heat sink, remove the four screws
(1)
that secure
the heat sink to the system board.
4.
Remove the heat sink from the system board
(2)
.
42
Chapter 5
Removal and replacement procedures for Authorized Service Provider parts