HP Pavilion 14-n100 Maintenance and Service Guide 1 - Page 93

Reverse this procedure to install the heat sink assembly on computer models equipped with switchable

Get HP Pavilion 14-n100 PDF manuals and user guides View all HP Pavilion 14-n100 manuals
Add to My Manuals
Save this manual to your list of manuals

Page 93 highlights

3. Remove the heat sink assembly (3) from the system board. NOTE: Due to the adhesive quality of the thermal material located between the heat sink assembly and the system board components, it may be necessary to move the heat sink assembly from side to side to detach it. 4. Remove the thermal material. The thermal material must be thoroughly cleaned from the surfaces of the heat sink assembly and the system board components each time the heat sink assembly is removed. Replacement thermal material is included with the heat sink assembly and system board spare part kits. ● Thermal paste is used on the processor (1) and the heat sink assembly section (2) that services it ● Thermal paste is used on the graphics subsystem chip (3) and the heat sink assembly section (4) that services it Reverse this procedure to install the heat sink assembly on computer models equipped with switchable discrete graphics. 5. Following the 1, 2, 3, 4 sequence stamped into the heat sink assembly, loosen the four Phillips PM2.0×10.0 captive screws (1) that secure the heat sink assembly to the system board. Component replacement procedures 83

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
  • 105
  • 106
  • 107
  • 108
  • 109
  • 110
  • 111
  • 112
  • 113
  • 114
  • 115
  • 116
  • 117
  • 118
  • 119
  • 120
  • 121
  • 122
  • 123
  • 124
  • 125
  • 126
  • 127
  • 128
  • 129
3.
Remove the heat sink assembly
(3)
from the system board.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink assembly
and the system board components, it may be necessary to move the heat sink assembly from side to
side to detach it.
4.
Remove the thermal material. The thermal material must be thoroughly cleaned from the surfaces of
the heat sink assembly and the system board components each time the heat sink assembly is
removed. Replacement thermal material is included with the heat sink assembly and system board
spare part kits.
●
Thermal paste is used on the processor
(1)
and the heat sink assembly section
(2)
that services it
●
Thermal paste is used on the graphics subsystem chip
(3)
and the heat sink assembly section
(4)
that services it
Reverse this procedure to install the heat sink assembly on computer models equipped with switchable
discrete graphics.
5.
Following the 1, 2, 3, 4 sequence stamped into the heat sink assembly, loosen the four Phillips
PM2.0×10.0 captive screws
(1)
that secure the heat sink assembly to the system board.
Component replacement procedures
83