HP Pavilion dm4 Maintenance and Service Guide - Page 89

Due to the adhesive quality of the thermal material located between the fan/heat sink

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NOTE: Steps 1 through 4 apply to computers with discrete subsystem memory on the system board. Steps 5 through 7 apply to computers with UMA subsystem memory. 1. Turn the system board upside down. 2. Disconnect the fan cable from the system board. 3. Follow the sequence embossed on heat sink to loosen the six Phillips PM2.5×7.0 captive screws (1) that secure the fan/heat sink assembly to the system board. NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink assembly and system board components, it may be necessary to move the fan/heat sink assembly from side to side to detach the assembly. Component replacement procedures 81

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NOTE:
Steps 1 through 4 apply to computers with discrete subsystem memory on the system
board. Steps 5 through 7 apply to computers with UMA subsystem memory.
1.
Turn the system board upside down.
2.
Disconnect the fan cable from the system board.
3.
Follow the sequence embossed on heat sink to loosen the six Phillips PM2.5×7.0 captive screws
(1)
that secure the fan/heat sink assembly to the system board.
NOTE:
Due to the adhesive quality of the thermal material located between the fan/heat sink
assembly and system board components, it may be necessary to move the fan/heat sink
assembly from side to side to detach the assembly.
Component replacement procedures
81