HP ProLiant BL495c HP BladeSystem c-Class SAN connectivity technology brief - Page 16
Conclusion, For more information, [email protected]
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Conclusion The interconnect design of HP BladeSystem c-Class enclosures offers close integration with SAN devices. Since HP BladeSystem c-Class architecture supports various interconnect methods, HP BladeSystem c-Class products provide the flexibility to meet a wide range of SAN connectivity goals. For more information For additional information related to the topics covered in this document, refer to the resources listed below. Resource description HP StorageWorks SAN Design Guide HP SAN Visibility Software Utility HP SAN Designer Software Utility Care Pack (for hardware and software information and for orderable part numbers) Rapid Deployment Pack Knowledge Base HP BladeSystem c-Class technical documentation HP Virtual Connect for c-Class BladeSystem Setup and Installation Guide HP Virtual Connect for c-Class BladeSystem User Guide Web address http://h20000.www2.hp.com/bc/docs/support/SupportMan ual/c00403562/c00403562.pdf. http://h18004.www1.hp.com/storage/networking/sansolutions .html?jumpid=reg_R1002_USEN http://h18004.www1.hp.com/storage/networking/sandesigner.html?ju mpid=reg_R1002_USEN http://www.hp.com/hps/carepack/servers/ http://www.hp.com/servers/rdp/kb http://h71028.www7.hp.com/enterprise/cache/316735-0-00-121.html http://bizsupport1.austin.hp.com/bc/docs/support/SupportM anual/c01732252/c01732252.pdf http://bizsupport1.austin.hp.com/bc/docs/support/SupportM anual/c00865618/c00865618.pdf Call to action Send comments about this paper to [email protected] © 2007, 2009 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. TC091106TB, November 2009 16