HP ProLiant BL620c HP BladeSystem c-Class architecture
HP ProLiant BL620c - G7 Server Manual
 |
View all HP ProLiant BL620c manuals
Add to My Manuals
Save this manual to your list of manuals |
HP ProLiant BL620c manual content summary:
- HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 1
13 Power and cooling architecture with HP Thermal Logic 13 Server blades and processors ...14 Enclosure ...14 Configuration and management technologies 16 Integrated Lights-Out...16 Onboard Administrator...17 HP Insight Control and HP Insight Dynamics 17 HP Virtual Connect and Virtual Connect - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 2
power backplane, power supplies, fans, and Onboard Administrator modules. The HP BladeSystem c7000 enclosure (Figure 1) is optimized for enterprise data centers. A single c7000 enclosure is 10U high and can hold up to 16 server, storage, or I/O option blades and up to eight interconnect modules. 2 - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 3
server blade Full-height server blade c7000 enclosure - back Interconnect modules Single-wide or double-wide 10 U Insight Display Redundant Redundant power fans supplies Redundant Onboard Administrators Redundant single phase, 3-phase, or DC power Note: "Technologies in the HP BladeSystem - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 4
, such as InfiniBand switches. The c3000 enclosure has four interconnect bays that can hold four single-wide or one double-wide and two single-wide interconnect modules. A c-Class enclosure also holds one or two Onboard Administrator management modules. A second Onboard Administrator module acts as - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 5
multiple fabrics using the same traces. Scalable blade form factors HP engineers chose the half-height and full-height blade form factors (scaling blades vertically in the c7000 enclosure and horizontally in the c3000 enclosure) to support cost, reliability, and ease-of-use requirements. Being - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 6
memory DIMMs (90º to PCB) Two full-height bays can be used in combination for a full-height double-wide blade form factor. Or, adjacent single-wide full-height blades can be used together. For example, HP Integrity server blades can combine multiple blades to create 2, 4, or 8 socket systems, as - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 7
performance. A single interconnect bay can accommodate two single-wide interconnect modules in a scale-out configuration the scalable device bays: Supports the maximum number of interconnect modules . The exact topology depends on your configuration and the enclosure. For example, if you place two - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 8
on your configuration. blades Interconnect Module A Interconnect Module B blades Interconnect Module A Interconnect Module B blades 6a blades 6b NonStop signal midplane provides flexibility The BladeSystem c-Class uses a high-speed, NonStop signal midplane that supports multiple highspeed - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 9
traces on the NonStop signal midplane. Connections differ depending on the enclosure. The c7000 enclosure was designed for fully redundant connections between the server blades and interconnect modules. Figure 8 shows how halfheight server blades connect to the interconnect bays in the c7000 - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 10
bays in the c3000 enclosure. Figure 9. Connection of half-height server blades to the interconnect bays in the c3000 enclosure For more information about connections, review the enclosure quick start guides at http://h18004.www1.hp.com/products/blades/components/c-class-tech-installing.html. To - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 11
drives StorageWorks Ultrium Tape Blades that hold LTO-2, LTO-3, or LTO-4 Ultrium tape cartridges BladeSystem PCI Expansion Blade that can hold two off-the-shelf PCI-X or PCIe cards High bandwidth and performance HP engineers architected the BladeSystem c-Class enclosures to support future - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 12
considerations for HP BladeSystem" available at http://h20000.www2.hp.com/bc/docs/support/SupportManual/ blade 4 (a-d-e). Therefore, a link configuration mechanism in the Onboard Administrator (assisted by iLO on each server blade) identifies the channel topology for each device and configures - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 13
active device is an EEPROM which the Onboard Administrator uses to get information such as the cost, improved performance, and improved HP Thermal Logic With the BladeSystem architecture, HP consolidated power and cooling resources while efficiently sharing and managing them within an enclosure - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 14
power to the device bays based on the specific configuration of each blade. As you insert blades into the enclosure, the Onboard Administrator discovers each one and allocates power, based on measured maximum power. For ProLiant servers, the BIOS performs a power test during POST and fine-tunes the - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 15
of fans, and the location of the blades. The Onboard Administrator reports thermal subsystem status and redundancy level, and will update the system log and alert HP SIM when the thermal subsystem status changes. Enclosure Dynamic Power Capping With Enclosure Dynamic Power Capping, you can set - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 16
For more information, see "Management architecture of HP BladeSystem c-Class systems" at http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00814176/c00814176.pdf. Interactions between the firmware components, BIOS, iLO, Onboard Administrator, Virtual Connect Manager, Smart Array, and NICs - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 17
server blade to form the core of the BladeSystem management architecture. Onboard Administrator performs configuration steps for the enclosure, collects thermal and power status, enables run-time management and configuration of the enclosure components, and informs technicians of problems within - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 18
or Fibre Channel networks so you can connect and pre-assign LAN and SAN connections only once. When each server blade is installed, you can quickly assign whatever LAN and SAN connections are needed for that server. There's no more need to wait until LAN and SAN administrators are available. 18 - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 19
WWN, and boot-from-SAN definitions that are assigned to BladeSystem enclosure bays and not to individual servers. The physical server in each HP Virtual Connect technology brief at http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00814156/c00814156.pdf Figure 14. HP Manager, you can set the 19 - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 20
and dual interconnects configured for redundancy Managing Virtual Connect To manage single Virtual Connect domains, the Virtual Connect Manager is a simple web console built into the firmware of Virtual Connect Ethernet modules. It is also accessible through the Onboard Administrator. This option - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 21
. And redundant Onboard Administrator modules can be used in an active-standby configuration. The c-Class architecture provides redundant paths using multiple facility power feeds into the enclosures, blade-to-interconnect bay connectivity, and blade-to-enclosure manager connectivity. Because - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 22
setup every time a server blade configuration changes. It is quick and easy to migrate the network service from a failed server blade to a functional server blade. Finally, the fans, power supplies, interconnect modules, Onboard Administrator modules, server blades, and storage blades are hot - HP ProLiant BL620c | HP BladeSystem c-Class architecture - Page 23
to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors
-
1 -
2 -
3 -
4 -
5 -
6 -
7 -
8
-
9
-
10
-
11
-
12
-
13
-
14
-
15
-
16
-
17
-
18
-
19
-
20
-
21
-
22
-
23
 |
 |
HP BladeSystem c-Class architecture
Technology brief, 3
rd
edition
Introduction
.........................................................................................................................................
2
Enclosures and hardware components
....................................................................................................
2
General-purpose flexible design
............................................................................................................
4
Scalable blade form factors
...............................................................................................................
5
Scalable interconnect form factors
......................................................................................................
7
Star topology
...................................................................................................................................
7
NonStop signal midplane provides flexibility
.......................................................................................
8
High bandwidth and performance
.......................................................................................................
11
NonStop signal midplane scalability
................................................................................................
11
Power backplane scalability and reliability
........................................................................................
13
Power and cooling architecture with HP Thermal Logic
...........................................................................
13
Server blades and processors
..........................................................................................................
14
Enclosure
......................................................................................................................................
14
Configuration and management technologies
.......................................................................................
16
Integrated Lights-Out
.......................................................................................................................
16
Onboard Administrator
...................................................................................................................
17
HP Insight Control and HP Insight Dynamics
......................................................................................
17
HP Virtual Connect and Virtual Connect Flex-10 technology
....................................................................
18
Virtual Connect
..............................................................................................................................
19
Virtual Connect Flex-10
...................................................................................................................
19
Virtual Connect FlexFabric
..............................................................................................................
20
Managing Virtual Connect
..............................................................................................................
20
Availability technologies
.....................................................................................................................
21
Redundant configurations
................................................................................................................
21
Reliable components
.......................................................................................................................
21
Reducing configuration time
............................................................................................................
21
For more information
..........................................................................................................................
22
Call to action
....................................................................................................................................
23