HP Stream 14-z000 HP Stream Notebook PC - Maintenance and Service Guide - Page 20

Packaging and transporting guidelines, CAUTION

Page 20 highlights

An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a normal cycle. Or the device may function normally for a while, then degrade in the internal layers, reducing its life expectancy. CAUTION: To prevent damage to the computer when you are removing or installing internal components, observe these precautions: Keep components in their electrostatic-safe containers until you are ready to install them. Before touching an electronic component, discharge static electricity by using the guidelines described in this section. Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible. If you remove a component, place it in an electrostatic-safe container. The following table shows how humidity affects the electrostatic voltage levels generated by different activities. CAUTION: A product can be degraded by as little as 700 V. Event Walking across carpet Walking across vinyl floor Motions of bench worker Removing DIPS from plastic tube Removing DIPS from vinyl tray Removing DIPS from Styrofoam Removing bubble pack from PCB Packing PCBs in foam-lined box Typical electrostatic voltage levels Relative humidity 10% 40% 35,000 V 15,000 V 12,000 V 5,000 V 6,000 V 800 V 2,000 V 700 V 11,500 V 4,000 V 14,500 V 5,000 V 26,500 V 20,000 V 21,000 V 11,000 V 55% 7,500 V 3,000 V 400 V 400 V 2,000 V 3,500 V 7,000 V 5,000 V Packaging and transporting guidelines Follow these grounding guidelines when packaging and transporting equipment: ● To avoid hand contact, transport products in static-safe tubes, bags, or boxes. ● Protect ESD-sensitive parts and assemblies with conductive or approved containers or packaging. ● Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations. ● Place items on a grounded surface before removing items from their containers. ● Always be properly grounded when touching a component or assembly. 14 Chapter 3 Removal and replacement preliminary requirements

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An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a normal
cycle. Or the device may function normally for a while, then degrade in the internal layers, reducing its life
expectancy.
CAUTION:
To prevent damage to the computer when you are removing or installing internal components,
observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Before touching an electronic component, discharge static electricity by using the guidelines described in this
section.
Avoid touching pins, leads, and circuitry.
Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity affects the electrostatic voltage levels generated by
different activities.
CAUTION:
A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event
10%
40%
55%
Walking across carpet
35,000 V
15,000 V
7,500 V
Walking across vinyl floor
12,000 V
5,000 V
3,000 V
Motions of bench worker
6,000 V
800 V
400 V
Removing DIPS from plastic tube
2,000 V
700 V
400 V
Removing DIPS from vinyl tray
11,500 V
4,000 V
2,000 V
Removing DIPS from Styrofoam
14,500 V
5,000 V
3,500 V
Removing bubble pack from PCB
26,500 V
20,000 V
7,000 V
Packing PCBs in foam-lined box
21,000 V
11,000 V
5,000 V
Packaging and transporting guidelines
Follow these grounding guidelines when packaging and transporting equipment:
To avoid hand contact, transport products in static-safe tubes, bags, or boxes.
Protect ESD-sensitive parts and assemblies with conductive or approved containers or packaging.
Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations.
Place items on a grounded surface before removing items from their containers.
Always be properly grounded when touching a component or assembly.
14
Chapter 3
Removal and replacement preliminary requirements