HP Vectra VEi8 HP Vectra VEi7, VEi8 & VLi8, Technical Reference Manual (V - Page 10

SECC package Core Components and Technologies Processors The heat sink is supplied with the processor, and is bolted to it by the manufacturer. The processor is held in place by a retention mechanism. Pentium II processors use either a Single Edge Contact Cartridge (SECC) or a Single Edge Contact Cartridge 2 (SECC 2) packaging technology. These packages allow the L2 cache to be tightly coupled to the processor, while enabling the use of high volume commercial SRAM components. The Pentium III comes in the SECC2 package only. Pentium Processor Packaging SECC (Single Edge Contact Cartridge) SECC2 (Single Edge Contact Cartridge 2) Heat Sink Weight Dissipation Attach Locations Connector Heat Sink Clip ATXV2 237 g 40 W Interfaces with thermal plate SC242 Riv screws SECC2 Heat Sink 130 g 36 W Substrate holes SC242 SECC2 H/S clip SECC 2 package (exploded view) heatsink processor heatsink clips 10