HP Vectra VEi8 HP Vectra VEi7, VEi8 & VLi8, Technical Reference Manual (V - Page 8

Core Components and Technologies Processors Processors Intel Celeron (Socket 370) The Socket 370 Intel® Celeron™ processor has the following features: • 128K on-die L2 cache • Intel MMX™ technology, which gives higher performance for media, communications and 3D applications. Socket 370 is a conversion of Slot 1 (used by the Pentium® II and Pentium III) to a socket. The Socket 370 Celeron shares the same P6 microarchitecture as the Pentium II. The reduction in size achieved by the Socket 370 Celeron is due to the integration of the L2 cache on the processor die. The heatsink is supplied separately from the processor. The processor is locked in place in the plastic pin grid array (PPGA) by a lever. Thermal efficiency is further enhanced by a heat interface gum supplied with the heatsink. Intel Pentium II The Pentium II processor connects to the motherboard via a single edge 242-contact slot (Slot 1) connector. It comes in either a SECC or a SECC 2 package (see "Pentium Processor Packages" below). The Pentium II processor has several performance-enhancing features: • Dual Independent Bus architecture, which combines a dedicated 64- bit L2 cache bus (supporting level cache sizes of 512K), plus a 64-bit system bus with non-ECC that enables multiple simultaneous transactions. • Intel MMX technology, which improves video compression/decompression, image manipulation, encryption and I/O processing. • Dynamic execution to speed up software performance. 8