HP rp3440 Site Preparation Guide, Fifth Edition - HP 9000 rp3410/rp3440 - Page 24

Raised Floor Metal Strip Ground System

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General Site Preparation Guidelines Electrical Factors • Better-A grounded #6 AWG minimum copper wire grid mechanically clamped to floor pedestals and properly bonded to the building or site ground • Good-Use the raised floor structure as a ground grid. In this case, the floor must be designed as a ground grid with bolted down stringers and corrosion resistive plating (to provide low resistance and attachment points for connection to service entrance ground and HP computer equipment). The use of conductive floor tiles with this style of grid further enhances ground performance. The structure needs to be mechanically bonded to a known good ground point Figure 2-1 Raised Floor Metal Strip Ground System 24 Chapter 2

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General Site Preparation Guidelines
Electrical Factors
Chapter 2
24
•
Better—A grounded #6 AWG minimum copper wire grid mechanically clamped to floor pedestals and
properly bonded to the building or site ground
•
Good—Use the raised floor structure as a ground grid. In this case, the floor must be designed as a ground
grid with bolted down stringers and corrosion resistive plating (to provide low resistance and attachment
points for connection to service entrance ground and HP computer equipment). The use of conductive floor
tiles with this style of grid further enhances ground performance. The structure needs to be mechanically
bonded to a known good ground point
Figure 2-1
Raised Floor Metal Strip Ground System