Intel BLKDP55WG Product Specification - Page 9

1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the board. Table 1. Feature Summary Form Factor Processor Memory Chipset Audio ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters]) • Intel® Core™ i5 and Intel® Core™ i5 processors in an LGA1156 socket: ― 1 x16 PCIe 2.0 Graphics interface (operates in x8 mode when second slot is populated) ― 1 x8 PCIe 2.0 Graphics interface ― Two DDR3 memory channels • Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets • Support for DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz DIMMs • Support for 1 Gb and 2 Gb memory technology • Support for up to 16 GB of system memory with four DIMMs using 2 Gb memory technology • Support for non-ECC memory • Support for 1.35 V low voltage JEDEC memory Intel® P55 Express Chipset consisting of the Intel® P55 Platform Controller Hub (PCH) Intel® High Definition Audio subsystem using the Realtek* ALC889 audio codec Legacy I/O Control Peripheral Interfaces BIOS Instantly Available PC Technology Nuvoton* legacy I/O controller for Consumer Infrared (CIR) • Fourteen USB 2.0 ports: ― Eight ports are implemented with stacked back panel connectors ― Three internal headers support six additional ports • Six internal Serial ATA (SATA) 3.0 Gb/s interfaces through the Intel P55 PCH with RAID support (black) • Two IEEE 1394a ports: ― One port via a back panel connector ― One port via a front-panel header (blue) • Intel® BIOS resident in the SPI Flash device • Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS • Support for PCI* Local Bus Specification Revision 2.2 • Support for PCI Express* Revision 2.0 • Suspend to RAM support • Wake on PCI, PCI Express, LAN, front panel, CIR, and USB ports continued 9