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Intel D2550MUD2 Technical product specification - Page 26

Audio Subsystem

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Intel Desktop Board D2550MUD2 Technical Product Specification 1.9 Audio Subsystem The board supports the Intel® High Definition Audio (Intel® HD Audio) subsystem. The audio subsystem consists of the following: • Intel NM10 Express Chipset • Realtek ALC662 audio codec The audio subsystem has the following features: • Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port. The back panel audio jacks are capable of retasking according to the user's definition, or can be automatically switched depending on the recognized device type. • Front panel Intel HD Audio and AC '97 audio support. • 3-port analog audio out stack. • Windows Vista Basic certification. • A signal-to-noise (S/N) ratio of 95 dB. Table 5 lists the supported functions of the front panel and back panel audio jacks. Table 5. Audio Jack Support Audio Jack Front panel - Green Front panel - Pink Back panel - Blue Back panel - Green Back panel - Pink Microphone Default Headphones Default (ctrl panel) Line Out (Front Spks) Default Line In (Stereo 2) Default Mic-In Default 26

Section	Page
Intel® Desktop Board D2550MUD2 Technical Product Specification	1
Revision History	2
Board Identification Information	3
Errata	3
Preface	5
Contents	7
1 Product Description	11
1.1 Overview	11
1.1.1 Feature Summary	11
1.1.2 Board Layout	13
1.1.3 Block Diagram	15
1.2 Online Support	16
1.3 Processor	16
1.3.1 Intel® D2550 Graphics Subsystem	17
1.4 System Memory	18
1.5 Intel® NM10 Express Chipset	20
1.5.2 USB	22
1.5.3 SATA Support	22
1.6 Real-Time Clock Subsystem	23
1.7 Legacy I/O Controller	23
1.8 LAN Subsystem	24
1.8.1 LAN Subsystem Drivers	24
1.8.2 RJ-45 LAN Connector with Integrated LEDs	25
1.9 Audio Subsystem	26
1.9.1 Audio Subsystem Software	27
1.9.2 Audio Connectors and Headers	27
1.10 Hardware Management Subsystem	28
1.10.1 Hardware Monitoring	28
1.10.2 Thermal Monitoring	29
1.11 Power Management	30
1.11.1 ACPI	30
1.11.2 Hardware Support	33
2 Technical Reference	37
2.1 Memory Map	37
2.1.1 Addressable Memory	37
2.2 Connectors and Headers	40
2.2.1 Back Panel	41
2.2.2 Component-side Connectors and Headers	43
2.3 BIOS Configuration Jumper Block	55
2.4 Mechanical Considerations	57
2.4.1 Form Factor	57
2.5 Electrical Considerations	58
2.5.1 Fan Header Current Capability	58
2.5.2 Add-in Board Considerations	58
2.6 Thermal Considerations	58
2.6.1 Passive Heatsink Design in a Passive System Environment	60
2.7 Power Consumption	63
2.7.1 Minimum Load Configuration	63
2.7.2 Maximum Load Configuration	63
2.8 Reliability	64
2.9 Environmental	64
3 Overview of BIOS Features	65
3.1 Introduction	65
3.2 BIOS Flash Memory Organization	66
3.3 Resource Configuration	66
3.3.1 PCI* Autoconfiguration	66
3.4 System Management BIOS (SMBIOS)	67
3.5 Legacy USB Support	68
3.6 BIOS Updates	69
3.6.1 BIOS Recovery	69
3.6.2 Custom Splash Screen	70
3.7 Boot Options	70
3.7.1 Optical Drive Boot	70
3.7.2 Network Boot	70
3.7.3 Booting Without Attached Devices	71
3.7.4 Changing the Default Boot Device During POST	71
3.8 Adjusting Boot Speed	71
3.8.1 Peripheral Selection and Configuration	71
3.8.2 BIOS Boot Optimizations	72
3.9 BIOS Security Features	73
4 Board Status and Error Messages	75
4.1 BIOS Beep Codes	75
4.2 Front-panel Power LED Blink Codes	76
4.3 BIOS Error Messages	76
4.4 Port 80h POST Codes	77
5 Regulatory Compliance and Battery Disposal Information	83
5.1 Regulatory Compliance	83
5.1.1 Safety Standards	83
5.1.2 European Union Declaration of Conformity Statement	84
5.1.3 Product Ecology Statements	85
5.1.4 EMC Regulations	87
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance	90
5.1.6 Regulatory Compliance Marks (Board Level)	91