Intel D2550MUD2 Technical product specification - Page 7

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Contents 1 Product Description 1.1 Overview 11 1.1.1 Feature Summary 11 1.1.2 Board Layout 13 1.1.3 Block Diagram 15 1.2 Online Support 16 1.3 Processor 16 1.3.1 Intel® D2550 Graphics Subsystem 17 1.4 System Memory 18 1.5 Intel® NM10 Express Chipset 20 1.5.2 USB 22 1.5.3 SATA Support 22 1.6 Real-Time Clock Subsystem 23 1.7 Legacy I/O Controller 23 1.8 LAN Subsystem 24 1.8.1 LAN Subsystem Drivers 24 1.8.2 RJ-45 LAN Connector with Integrated LEDs 25 1.9 Audio Subsystem 26 1.9.1 Audio Subsystem Software 27 1.9.2 Audio Connectors and Headers 27 1.10 Hardware Management Subsystem 28 1.10.1 Hardware Monitoring 28 1.10.2 Thermal Monitoring 29 1.11 Power Management 30 1.11.1 ACPI 30 1.11.2 Hardware Support 33 2 Technical Reference 2.1 Memory Map 37 2.1.1 Addressable Memory 37 2.2 Connectors and Headers 40 2.2.1 Back Panel 41 2.2.2 Component-side Connectors and Headers 43 2.3 BIOS Configuration Jumper Block 55 2.4 Mechanical Considerations 57 2.4.1 Form Factor 57 2.5 Electrical Considerations 58 2.5.1 Fan Header Current Capability 58 2.5.2 Add-in Board Considerations 58 2.6 Thermal Considerations 58 2.6.1 Passive Heatsink Design in a Passive System Environment ......... 60 vii

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vii
Contents
1
Product Description
1.1
Overview
.........................................................................................
11
1.1.1
Feature Summary
.................................................................
11
1.1.2
Board Layout
........................................................................
13
1.1.3
Block Diagram
......................................................................
15
1.2
Online Support
.................................................................................
16
1.3
Processor
........................................................................................
16
1.3.1
Intel
®
D2550 Graphics Subsystem
...........................................
17
1.4
System Memory
...............................................................................
18
1.5
Intel
®
NM10 Express Chipset
..............................................................
20
1.5.2
USB
.....................................................................................
22
1.5.3
SATA Support
.......................................................................
22
1.6
Real-Time Clock Subsystem
...............................................................
23
1.7
Legacy I/O Controller
........................................................................
23
1.8
LAN Subsystem
................................................................................
24
1.8.1
LAN Subsystem Drivers
..........................................................
24
1.8.2
RJ-45 LAN Connector with Integrated LEDs
..............................
25
1.9
Audio Subsystem
..............................................................................
26
1.9.1
Audio Subsystem Software
.....................................................
27
1.9.2
Audio Connectors and Headers
................................................
27
1.10
Hardware Management Subsystem
.....................................................
28
1.10.1
Hardware Monitoring
.............................................................
28
1.10.2
Thermal Monitoring
...............................................................
29
1.11
Power Management
..........................................................................
30
1.11.1
ACPI
....................................................................................
30
1.11.2
Hardware Support
.................................................................
33
2
Technical Reference
2.1
Memory Map
....................................................................................
37
2.1.1
Addressable Memory
.............................................................
37
2.2
Connectors and Headers
....................................................................
40
2.2.1
Back Panel
...........................................................................
41
2.2.2
Component-side Connectors and Headers
.................................
43
2.3
BIOS Configuration Jumper Block
.......................................................
55
2.4
Mechanical Considerations
.................................................................
57
2.4.1
Form Factor
..........................................................................
57
2.5
Electrical Considerations
....................................................................
58
2.5.1
Fan Header Current Capability
................................................
58
2.5.2
Add-in Board Considerations
...................................................
58
2.6
Thermal Considerations
.....................................................................
58
2.6.1
Passive Heatsink Design in a Passive System Environment
.........
60