Intel D925XHY English Product Guide - Page 15

Intel, 925X Express Chipset, Audio Subsystem

Page 15 highlights

Desktop Board Features Intel® 925X Express Chipset The Intel 925X Express Chipset consists of the following devices: • Intel 82925X Memory Controller Hub (MCH) with Direct Media Interface • Intel 82801FR I/O Controller Hub (ICH6-R) Related Link Go to the following link for more information about the Intel 925X Express Chipset: http://developer.intel.com/design/nav/pcserver.htm Audio Subsystem Desktop Board D925XHY includes a flexible 7.1-channel audio subsystem based on an Intel High Definition Audio codec: The audio subsystem features: • Impedance sensing capability for jack re-tasking • S/N (signal-to-noise) ratio: > 90 dB • Power management support for ACPI 2.0 (driver dependent) • Intel 82801FR I/O Controller Hub (ICH6-R) • Realtek Semiconductor Corporation audio codec • Microphone input that supports: ⎯ Microphone array ⎯ Acoustic Echo (AEC) ⎯ Beam Forming (BF) ⎯ Noise Suppression (NX) technology The subsystem includes the following connectors: • Front panel audio connector, including pins for: ⎯ Line out ⎯ Mic • Back panel audio connectors that are configurable through the drivers of the audio devices: ⎯ Line in ⎯ Three Line out ⎯ Mic in or Center LFE out ⎯ Two digital line out: • One coaxial line out • One optical (Toslink) line out Related Links Go to the following link or pages for more information about: • Audio drivers and utilities http://support.intel.com/support/motherboards/desktop/ • The location of back panel audio connectors, page 51 in Chapter 2 15

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Desktop Board Features
15
Intel
®
925X Express Chipset
The Intel 925X Express Chipset consists of the following devices:
Intel 82925X Memory Controller Hub (MCH) with Direct Media Interface
Intel 82801FR I/O Controller Hub (ICH6-R)
Related Link
Go to the following link for more information about the Intel 925X Express Chipset:
Audio Subsystem
Desktop Board D925XHY includes a flexible 7.1-channel audio subsystem based on an Intel High
Definition Audio codec:
The audio subsystem features:
Impedance sensing capability for jack re-tasking
S/N (signal-to-noise) ratio: > 90 dB
Power management support for ACPI 2.0 (driver dependent)
Intel 82801FR I/O Controller Hub (ICH6-R)
Realtek Semiconductor Corporation audio codec
Microphone input that supports:
Microphone array
Acoustic Echo (AEC)
Beam Forming (BF)
Noise Suppression (NX) technology
The subsystem includes the following connectors:
Front panel audio connector, including pins for:
Line out
Mic
Back panel audio connectors that are configurable through the drivers of the audio devices:
Line in
Three Line out
Mic in or Center LFE out
Two digital line out:
One coaxial line out
One optical (Toslink) line out
Related Links
Go to the following link or pages for more information about:
Audio drivers and utilities
The location of back panel audio connectors, page 51 in Chapter 2