Intel DG965RY Product Specification - Page 64

Localized High Temperature Zones, Table 33. Thermal Considerations for Components

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Intel Desktop Board DG965RY Technical Product Specification Figure 23 shows the locations of the localized high temperature zones. Item A B C D Description Processor voltage regulator area Processor Intel 82G965 GMCH Intel 82801HB ICH8 Figure 23. Localized High Temperature Zones Table 33 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 33. Thermal Considerations for Components Component Processor Maximum Case Temperature For processor case temperature, see processor datasheets and processor specification updates Intel 82G965 GMCH Intel 82801HB ICH8 97 oC (under bias) 92 oC (under bias) For information about Processor datasheets and specification updates Refer to Section 1.2, page 15 64

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Intel Desktop Board DG965RY Technical Product Specification
64
Figure 23 shows the locations of the localized high temperature zones.
Item
Description
A
Processor voltage regulator area
B
Processor
C
Intel
82G965 GMCH
D
Intel
82801HB ICH8
Figure 23.
Localized High Temperature Zones
Table 33 provides maximum case temperatures for the board components that are
sensitive to thermal changes.
The operating temperature, current load, or operating
frequency could affect case temperatures.
Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 33. Thermal Considerations for Components
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel 82G965 GMCH
97
o
C (under bias)
Intel 82801HB ICH8
92
o
C (under bias)
For information about
Refer to
Processor datasheets and specification updates
Section 1.2, page 15