Intel DG965RY Product Specification - Page 7

Regulatory Compliance and Battery Disposal Information, s, Tables - front panel

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Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance 81 5.1.1 Safety Regulations 81 5.1.2 European Union Declaration of Conformity Statement 82 5.1.3 Product Ecology Statements 84 5.1.4 EMC Regulations 87 5.1.5 Product Certification Markings (Board Level 88 5.2 Battery Disposal Information 89 Figures 1. Major Board Components 12 2. Block Diagram 14 3. Memory Channel and DIMM Configuration 18 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs 19 5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs ......... 19 6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs 20 7. Single Channel (Asymmetric) Mode Configuration with One DIMM .......... 21 8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs....... 21 9. Flex Mode Configuration with Two DIMMs 22 10. Front/Back Panel Audio Connector Options 30 11. LAN Connector LED Locations 32 12. Thermal Sensors and Fan Headers 34 13. Location of the Standby Power Indicator LED 40 14. Detailed System Memory Address Map 42 15. Back Panel Connectors 49 16. Component-side Connectors and Headers 50 17. Connection Diagram for Front Panel Header 55 18. Connection Diagram for Front Panel USB Headers 57 19. Connection Diagram for IEEE 1394a Header 57 20. Location of the Jumper Block 58 21. Board Dimensions 59 22. I/O Shield Dimensions 60 23. Localized High Temperature Zones 64 Tables 1. Feature Summary 10 2. Board Components Shown in Figure 1 13 3. Supported Memory Configurations 16 4. Memory Operating Frequencies 17 5. Audio Jack Retasking Support 29 6. LAN Connector LED States 32 7. Effects of Pressing the Power Switch 35 8. Power States and Targeted System Power 36 9. Wake-up Devices and Events 37 10. System Memory Map 43 vii

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Contents
vii
5
Regulatory Compliance and Battery Disposal Information
5.1
Regulatory Compliance
.....................................................................
81
5.1.1
Safety Regulations
................................................................
81
5.1.2
European Union Declaration of Conformity Statement
................
82
5.1.3
Product Ecology Statements
...................................................
84
5.1.4
EMC Regulations
..................................................................
87
5.1.5
Product Certification Markings (Board Level)
.............................
88
5.2
Battery Disposal Information
.............................................................
89
Figures
1.
Major Board Components
..................................................................
12
2.
Block Diagram
................................................................................
14
3.
Memory Channel and DIMM Configuration
...........................................
18
4.
Dual Channel (Interleaved) Mode Configuration with Two DIMMs
............
19
5.
Dual Channel (Interleaved) Mode Configuration with Three DIMMs
.........
19
6.
Dual Channel (Interleaved) Mode Configuration with Four DIMMs
...........
20
7.
Single Channel (Asymmetric) Mode Configuration with One DIMM
..........
21
8.
Single Channel (Asymmetric) Mode Configuration with Three DIMMs
.......
21
9.
Flex Mode Configuration with Two DIMMs
............................................
22
10. Front/Back Panel Audio Connector Options
..........................................
30
11. LAN Connector LED Locations
............................................................
32
12. Thermal Sensors and Fan Headers
.....................................................
34
13. Location of the Standby Power Indicator LED
.......................................
40
14. Detailed System Memory Address Map
...............................................
42
15. Back Panel Connectors
.....................................................................
49
16. Component-side Connectors and Headers
...........................................
50
17. Connection Diagram for Front Panel Header
........................................
55
18. Connection Diagram for Front Panel USB Headers
................................
57
19. Connection Diagram for IEEE 1394a Header
........................................
57
20. Location of the Jumper Block
.............................................................
58
21. Board Dimensions
...........................................................................
59
22. I/O Shield Dimensions
......................................................................
60
23. Localized High Temperature Zones
.....................................................
64
Tables
1.
Feature Summary
............................................................................
10
2.
Board Components Shown in Figure 1
................................................
13
3.
Supported Memory Configurations
.....................................................
16
4.
Memory Operating Frequencies
.........................................................
17
5.
Audio Jack Retasking Support
...........................................................
29
6.
LAN Connector LED States
................................................................
32
7.
Effects of Pressing the Power Switch
..................................................
35
8.
Power States and Targeted System Power
...........................................
36
9.
Wake-up Devices and Events
............................................................
37
10.
System Memory Map
.......................................................................
43