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Intel DG965RY Product Specification - Page 65

Reliability, Environmental

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Technical Reference 2.13 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The Desktop Board DG965RY MTBF is 121,751 hours. 2.14 Environmental Table 34 lists the environmental specifications for the board. Table 34. Desktop Board DG965RY Environmental Specifications Parameter Specification Temperature Non-Operating Operating -40 °C to +70 °C 0 °C to +55 °C Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/second² Packaged Half sine 2 millisecond Product weight (pounds) Free fall (inches) Velocity change (inches/sec²)

Section	Page
Intel® Desktop Board DG965RY Technical Product Specification	1
Revision History / Disclaimer	2
Preface	3
Intended Audience	3
What This Document Contains	3
Typographical Conventions	3
Contents	5
1 Product Description	9
1.1 Overview	10
1.1.1 Feature Summary	10
1.1.2 Board Layout	12
1.1.3 Block Diagram	14
1.2 Online Support	15
1.3 Processor	15
1.4 System Memory	16
1.4.1 Memory Configurations	17
1.5 Intel® G965 Express Chipset	23
1.5.1 Intel G965 Graphics Subsystem	23
1.5.2 USB	26
1.5.3 Serial ATA Interfaces	26
1.5.4 Parallel IDE Interface	27
1.5.5 Real-Time Clock, CMOS SRAM, and Battery	27
1.6 Legacy I/O Controller	28
1.6.1 Serial Port	28
1.6.2 Parallel Port	28
1.6.3 Diskette Drive Controller	28
1.6.4 Keyboard and Mouse Interface	28
1.7 Audio Subsystem	29
1.7.1 Audio Subsystem Software	29
1.7.2 Audio Connectors and Headers	30
1.8 LAN Subsystem	31
1.8.1 Intel® 82566DC Gigabit Ethernet Controller	31
1.8.2 LAN Subsystem Software	31
1.8.3 RJ-45 LAN Connector with Integrated LEDs	32
1.9 Hardware Management Subsystem	33
1.9.1 Hardware Monitoring and Fan Control	33
1.9.2 Fan Monitoring	33
1.9.3 Chassis Intrusion and Detection	33
1.9.4 Thermal Monitoring	34
1.10 Power Management	35
1.10.1 ACPI	35
1.10.2 Hardware Support	37
2 Technical Reference	41
2.1 Memory Map	41
2.1.1 Addressable Memory	41
2.2 DMA Channels	43
2.3 Fixed I/O Map	44
2.4 PCI Configuration Space Map	45
2.5 Interrupts	46
2.6 DMA Channels	47
2.7 PCI Interrupt Routing Map	47
2.8 Connectors and Headers	48
2.8.1 Back Panel Connectors	49
2.8.2 Component-side Connectors and Headers	50
2.9 Jumper Block	58
2.10 Mechanical Considerations	59
2.10.1 Form Factor	59
2.10.2 I/O Shield	60
2.11 Electrical Considerations	61
2.11.1 DC Loading	61
2.11.2 Fan Header Current Capability	61
2.11.3 Add-in Board Considerations	62
2.11.4 Power Supply Considerations	62
2.12 Thermal Considerations	63
2.13 Reliability	65
2.14 Environmental	65
3 Overview of BIOS Features	67
3.1 Introduction	67
3.2 BIOS Flash Memory Organization	68
3.3 Resource Configuration	68
3.3.1 PCI Autoconfiguration	68
3.3.2 PCI IDE Support	69
3.4 System Management BIOS (SMBIOS)	69
3.5 Legacy USB Support	70
3.6 BIOS Updates	70
3.6.1 Language Support	71
3.6.2 Custom Splash Screen	71
3.7 BIOS Recovery	71
3.8 Boot Options	72
3.8.1 CD-ROM Boot	72
3.8.2 Network Boot	72
3.8.3 Booting Without Attached Devices	72
3.8.4 Changing the Default Boot Device During POST	72
3.9 Adjusting Boot Speed	73
3.9.1 Peripheral Selection and Configuration	73
3.9.2 BIOS Boot Optimizations	73
3.10 BIOS Security Features	74
4 Error Messages and Beep Codes	75
4.1 Speaker	75
4.2 BIOS Beep Codes	75
4.3 BIOS Error Messages	75
4.4 Port 80h POST Codes	76
5 Regulatory Compliance and Battery Disposal Information	81
5.1 Regulatory Compliance	81
5.1.1 Safety Regulations	81
5.1.2 European Union Declaration of Conformity Statement	82
5.1.3 Product Ecology Statements	84
5.1.4 EMC Regulations	87
5.1.5 Product Certification Markings (Board Level)	88