Intel E3300 Data Sheet - Page 75

Thermal Specifications and Design Considerations 5 Thermal Specifications and Design Considerations 5.1 Note: 5.1.1 Processor Thermal Specifications The processor requires a thermal solution to maintain temperatures within the operating limits as set forth in Section 5.1.1. Any attempt to operate the processor outside these operating limits may result in permanent damage to the processor and potentially other components within the system. As processor technology changes, thermal management becomes increasingly crucial when building computer systems. Maintaining the proper thermal environment is key to reliable, long-term system operation. A complete thermal solution includes both component and system level thermal management features. Component level thermal solutions can include active or passive heatsinks attached to the processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of system fans combined with ducting and venting. For more information on designing a component level thermal solution, refer to the appropriate Thermal and Mechanical Design Guidelines (see Section 1.2). The boxed processor will ship with a component thermal solution. Refer to Chapter 7 for details on the boxed processor. Thermal Specifications To allow for the optimal operation and long-term reliability of Intel processor-based systems, the system/processor thermal solution should be designed such that the processor remains within the minimum and maximum case temperature (TC) specifications when operating at or below the Thermal Design Power (TDP) value listed per frequency in Table 25. Thermal solutions not designed to provide this level of thermal capability may affect the long-term reliability of the processor and system. For more details on thermal solution design, refer to the appropriate Thermal and Mechanical Design Guidelines (see Section 1.2). The processor uses a methodology for managing processor temperatures that is intended to support acoustic noise reduction through fan speed control. Selection of the appropriate fan speed is based on the relative temperature data reported by the processor's Platform Environment Control Interface (PECI) bus as described in Section 5.3. If the value reported using PECI is less than TCONTROL, then the case temperature is permitted to exceed the Thermal Profile. If the value reported using PECI is greater than or equal to TCONTROL, then the processor case temperature must remain at or below the temperature as specified by the thermal profile. The temperature reported over PECI is always a negative value and represents a delta below the onset of thermal control circuit (TCC) activation, as indicated by PROCHOT# (see Section 5.2). Systems that implement fan speed control must be designed to take these conditions in to account. Systems that do not alter the fan speed only need to ensure the case temperature meets the thermal profile specifications. To determine a processor's case temperature specification based on the thermal profile, it is necessary to accurately measure processor power dissipation. Intel has developed a methodology for accurate power measurement that correlates to Intel test temperature and voltage conditions. Refer to the appropriate Thermal and Mechanical Design Guidelines (see Section 1.2) for the details of this methodology. Datasheet 75