Intel SE7500WV2 Product Guide - Page 14

Flex Bay, 500 Watt Redundant Power Supply, 480 Watt Power Supply, System Cooling

Page 14 highlights

✏ NOTE Drives can consume up to 17W of power each. Drives must be specified to run at a maximum ambient temperature of 50 °C. Flex Bay The flex bay can be used with either the optional DVD/FDD module, CD-ROM/FDD module, or a seventh hot swappable SCSI HDD. The DVD/CD-ROM/FDD module may only be inserted or removed from the flex bay when system power is turned off. It is NOT hot swappable. For information on installation, see "Installing a DVD drive/FDD or CD-ROM drive/FDD Module" on page 40. 500 Watt Redundant Power Supply The power supply consists of the power supply bay and one power supply module. A second power supply module can be purchased to provide a redundant, 1+1 system. With either configuration, the power supply provides 500 W of power and is designed to minimize EMI. The power supply operates within the following voltage ranges and is rated as follows: • 100-120 V∼ at 50/60 Hertz (Hz); 5.2 A maximum • 200-240 V∼ at 50/60 Hz; 2.6 A maximum The power subsystem supports implementation of remote management features including remote enable that permits power to be activated from a variety of sources. 480 Watt Power Supply The power supply consists of the power supply; no modules are available. The power supply provides 480W of power and is designed to minimize EMI. The power supply operates within the following voltage ranges and is rated as follows: • 100-120 V∼ at 50/60 Hz; 6.8 A maximum • 200-240 V∼ at 50/60 Hz; 3.4 A maximum The power subsystem supports implementation of remote management features including remote enable that permits power to be activated from a variety of sources. System Cooling The chassis includes three 60-mm non-hot-swappable system fans for cooling the processor(s), hard drives, and add-in cards. A fourth fan may be added to provide cooling redundancy for system components. The system fans are mounted in a fan module located in the middle of the chassis to pull cooling air through the chassis. The power supply contains a single fan for cooling. 14 Intel SR2300 Chassis Subassembly Product Guide

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14
Intel SR2300 Chassis Subassembly Product Guide
NOTE
Drives can consume up to 17W of power each.
Drives must be specified to
run at a maximum ambient temperature of 50
°
C.
Flex Bay
The flex bay can be used with either the optional DVD/FDD module, CD-ROM/FDD module, or a
seventh hot swappable SCSI HDD.
The DVD/CD-ROM/FDD module may only be inserted or removed from the flex bay when system
power is turned off.
It is NOT hot swappable.
For information on installation, see
Installing a
DVD drive/FDD or CD-ROM drive/FDD Module
on page 40.
500 Watt Redundant Power Supply
The power supply consists of the power supply bay and one power supply module.
A second
power supply module can be purchased to provide a redundant, 1+1 system.
With either
configuration, the power supply provides 500 W of power and is designed to minimize EMI.
The
power supply operates within the following voltage ranges and is rated as follows:
100-120 V
at 50/60 Hertz (Hz); 5.2 A maximum
200-240 V
at 50/60 Hz; 2.6 A maximum
The power subsystem supports implementation of remote management features including remote
enable that permits power to be activated from a variety of sources.
480 Watt Power Supply
The power supply consists of the power supply; no modules are available.
The power supply
provides 480W of power and is designed to minimize EMI.
The power supply operates within the
following voltage ranges and is rated as follows:
100-120 V
at 50/60 Hz; 6.8 A maximum
200-240 V
at 50/60 Hz; 3.4 A maximum
The power subsystem supports implementation of remote management features including remote
enable that permits power to be activated from a variety of sources.
System Cooling
The chassis includes three 60-mm non-hot-swappable system fans for cooling the processor(s), hard
drives, and add-in cards.
A fourth fan may be added to provide cooling redundancy for system
components.
The system fans are mounted in a fan module located in the middle of the chassis to
pull cooling air through the chassis.
The power supply contains a single fan for cooling.