Intel SSR316MJ2 Product Specification - Page 21

Enclosure Management

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Intel® Storage System SSR316MJ2 TPS Feature Summary 1.5 Enclosure Management The enclosure management controller monitors various aspects of a storage enclosure. The controller provides out-of-band SAF-TE management through the SATA Host I2C interface. The enclosure management controller is comprised of the following elements and supports associated features: • Atmel* AT89C51* micro-controller o Implements SAF-TE command set o I2C multiplex control o SRAM interface o 16 KB on-chip flash memory o Field updateable through SATA HBA I2C bus o Very Thin Quad Flat Pack (VQFP) 44-pin package • 256 K external SRAM memory o 32Kx8 organization o Runtime support for Micro and PLD o Small Outline Integrated Circuit (SOIC) (narrow 300mil) 28-pin package • EPM3256 PLD o I2C multiplexer for up to three HBA I2C connections o In-circuit programmable o SRAM interface o Drive presence detect o Activity/Fault LED support o Delayed drive spin-up control o Thin Quad Flat Pack (TQFP) 144-pin package The components operate from 3.3 V and an input clock frequency of 20 MHz. 1.5.1 Enclosure Management Hardware Implementation Enclosure Management has three main hardware components, the Micro-Controller, External SRAM memory and the PLD hardware controller and a memory arbitrator. Revision 1.0 11 Intel Order number C75916-001

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Intel® Storage System SSR316MJ2 TPS
Feature Summary
Revision 1.0
11
Intel Order number C75916-001
1.5
Enclosure Management
The enclosure management controller monitors various aspects of a storage enclosure.
The
controller provides out-of-band SAF-TE management through the SATA Host I
2
C interface.
The enclosure management controller is comprised of the following elements and supports
associated features:
•
Atmel* AT89C51* micro-controller
o
Implements SAF-TE command set
o
I
2
C multiplex control
o
SRAM interface
o
16 KB on-chip flash memory
o
Field updateable through SATA HBA I
2
C bus
o
Very Thin Quad Flat Pack (VQFP) 44-pin package
•
256 K external SRAM memory
o
32Kx8 organization
o
Runtime support for Micro and PLD
o
Small Outline Integrated Circuit (SOIC) (narrow 300mil) 28-pin package
•
EPM3256 PLD
o
I
2
C multiplexer for up to three HBA I
2
C connections
o
In-circuit programmable
o
SRAM interface
o
Drive presence detect
o
Activity/Fault LED support
o
Delayed drive spin-up control
o
Thin Quad Flat Pack (TQFP) 144-pin package
The components operate from 3.3 V and an input clock frequency of 20 MHz.
1.5.1
Enclosure Management Hardware Implementation
Enclosure Management has three main hardware components, the Micro-Controller, External
SRAM memory and the PLD hardware controller and a memory arbitrator.