Lenovo ThinkPad W510 Hardware Maintenance Manual - Page 111

Accelerometer chip for the HDD Active Protection System, MCP Multi Chip Package processor

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Table 35. Location of major sensitive components on the system board Following components soldered on the top side of the system board are extremely sensitive. When you service the system board, avoid any kind of rough handling. a MCP (Multi Chip Package) processor b PCH (Platform Controller Hub) c Accelerometer chip for the HDD Active Protection System™ d Graphics Note: d (Graphics) is only for the Switchable Graphics models and Workstation models. The system board in Integrated Graphics models does not have this chip. For Integrated Graphics models: a For Switchable Graphics models: a cb d For Workstation models: cb Chapter 9. Removing and replacing a FRU 105

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Table 35. Location of major sensitive components on the system board
Following components soldered on the top side of the system board are extremely sensitive. When you service
the system board, avoid any kind of rough handling.
a
MCP (Multi Chip Package) processor
b
PCH (Platform Controller Hub)
c
Accelerometer chip for the HDD Active Protection System
™
d
Graphics
Note:
d
(Graphics) is only for the Switchable Graphics models and Workstation models. The system
board in Integrated Graphics models does not have this chip.
For Integrated Graphics models:
a
b
c
For Switchable Graphics models:
d
a
b
c
For Workstation models:
Chapter 9
.
Removing and replacing a FRU
105