Sony HCD-HPX7 Service Manual - Page 3

Notes on chip component replacement, Flexible Circuit Board Repairing, CAUTION, UNLEADED SOLDER,

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HCD-HPX7 Notes on chip component replacement • Never reuse a disconnected chip component. • Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing • Keep the temperature of the soldering iron around 270 °C during repairing. • Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). • Be careful not to apply force on the conductor when soldering or unsoldering. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. This appliance is classified as a CLASS 1 LASER product. This label is located on the rear exterior. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. • Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! • Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. • Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. 3

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3
HCD-HPX7
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270
°
C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
This appliance is
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
SAFETY-RELATED
COMPONENT
WARNING!!
COMPONENTS
IDENTIFIED
BY
MARK
0
OR
DOTTED
LINE
WITH
MARK
0
ON
THE
SCHEMATIC
DIAGRAMS
AND
IN
THE
PARTS
LIST
ARE
CRITICAL
TO
SAFE
OPERATION.
REPLACE
THESE
COMPONENTS
WITH
SONY
PARTS
WHOSE
PART NUMBERS
APPEAR
AS
SHOWN
IN
THIS
MANUAL
OR
IN
SUPPLEMENTS
PUBLISHED
BY
SONY.
ATTENTION
AU
COMPOSANT
AYANT
RAPPORT
À
LA
SÉCURITÉ!
LES
COMPOSANTS
IDENTIFIÉS
PAR
UNE
MARQUE
0
SUR
LES
DIAGRAMMES
SCHÉMATIQUES
ET
LA
LISTE
DES
PIÈCES
SONT
CRITIQUES
POUR
LA
SÉCURITÉ
DE
FONCTIONNEMENT.
NE
REMPLACER
CES
COM-
POSANTS
QUE
PAR
DES
PIÈCES
SONY
DONT
LES
NUMÉROS
SONT
DONNÉS
DANS
CE
MANUEL
OU
DANS
LES
SUPPLÉMENTS
PUBLIÉS
PAR
SONY.