HP Dv7-2170us HP Pavilion dv7 Entertainment PC - Maintenance and Service Guide - Page 96

and graphics/heat sink, that services it. Thermal pads are used on the graphics subsystem chip

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Removal and replacement procedures 5. Turn the system board upside down, with the expansion port 3 and external monitor port toward you. 6. Disconnect the fan cable 1 from the system board. 7. Loosen the four Phillips PM2.5×6.0 captive screws 2 that secure the fan/heat sink assembly to the system board. 8. Remove the fan/heat sink assembly 3 from the system board. ✎ Due to the adhesive quality of the thermal material located between the fan/heat sink assembly and system board components, it may be necessary to move the fan/heat sink assembly from side to side to detach the assembly. ✎ The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system board each time the fan/heat sink assembly is removed. Thermal paste is used on the processor 1 and the heat sink section 2 that services it. Thermal pads are used on the graphics subsystem chip 3 and graphics/heat sink contact 4, the Northbridge chip 5 and Northbridge contact 6. Replacement thermal material is included with all fan/heat sink assembly, system board, and processor spare part kits. Reverse this procedure to install the fan/heat sink assembly. Maintenance and Service Guide 4-53

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Removal and replacement procedures
Maintenance and Service Guide
4–53
5. Turn the system board upside down, with the expansion port 3 and external monitor port toward you.
6. Disconnect the fan cable
1
from the system board.
7. Loosen the four Phillips PM2.5×6.0 captive screws
2
that secure the fan/heat sink assembly to the system
board.
8. Remove the fan/heat sink assembly
3
from the system board.
✎
Due to the adhesive quality of the thermal material located between the fan/heat sink assembly and system board
components, it may be necessary to move the fan/heat sink assembly from side to side to detach the assembly.
✎
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system
board each time the fan/heat sink assembly is removed. Thermal paste is used on the processor
1
and the heat
sink section
2
that services it. Thermal pads are used on the graphics subsystem chip
3
and graphics/heat sink
contact
4
, the Northbridge chip
5
and Northbridge contact
6
. Replacement thermal material is included with all
fan/heat sink assembly, system board, and processor spare part kits.
Reverse this procedure to install the fan/heat sink assembly.