HP Pavilion dv3-2000 HP Pavilion dv3 Entertainment PC - Maintenance and Servic - Page 97
and heat sink s, Thermal pads are used on the other system board components
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Removal and replacement procedures ✎ The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system board each time the fan/heat sink assembly is removed: ■ Thermal paste is used on the processor 1 and the heat sink section 2 that services it. ■ Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it. ■ Thermal pads are used on the graphics subsystem memory module 5 and the heat sink section 6 that services it. ■ Thermal pads are used on the other system board components 7 and heat sink sections 8 that service them. Replacement thermal material is included with all system board, fan/heat sink assembly, and processor spare part kits. 4-52 Maintenance and Service Guide