HP Pavilion g4 Maintenance and Service Guide - Page 89
Steps 5 through 7 apply to computer models equipped with an Intel processor. See, discrete memory
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NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the base enclosure, heat sink, processor, and system board spare part kits. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that services it ● A thermal pad is used on the graphics subsystem chip (5) and the heat sink section (6) that services it (only on computer models equipped with a graphics subsystem with discrete memory) NOTE: Steps 5 through 7 apply to computer models equipped with an Intel processor. See steps 2 through 4 for heat sink removal information for computer models equipped with an AMD processor. 5. Disconnect the fan cable (1) from the system board. Component replacement procedures 81