Intel E6750 Design Guidelines

Intel E6750 - Core 2 Duo Dual-Core Processor Manual

Get Intel E6750 - Core 2 Duo Dual-Core Processor PDF manuals and user guides
UPC - 735858194464
View all Intel E6750 manuals
Add to My Manuals
Save this manual to your list of manuals

Intel E6750 manual content summary:

  • Intel E6750 | Design Guidelines - Page 1
    ® Core™2 Duo Processor, Intel® Pentium® Dual Core Processor, and Intel® Celeron® Dual-Core Processor Thermal and Mechanical Design Guidelines Supporting the: - Intel® Core™2 Duo Processor E6000 and E4000 Series - Intel® Pentium® Dual Core Processor E2000 Series - Intel® Celeron® Dual-Core Processor
  • Intel E6750 | Design Guidelines - Page 2
    , or by visiting http://www.intel.com . The Intel® Core™2 Duo processor, Intel® Pentium® Dual Core processor and Intel® Pentium® 4 processor may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are
  • Intel E6750 | Design Guidelines - Page 3
    Thermal Solution Performance Assessment 29 3.3 Local Ambient Temperature Measurement Guidelines 29 3.4 Processor Case Temperature Measurement Guidelines 32 4 Thermal Management Logic and Thermal Monitor Feature 33 4.1 Processor Power Dissipation 33 4.2 Thermal Monitor Implementation 33
  • Intel E6750 | Design Guidelines - Page 4
    Structural Reliability Testing 61 Power Cycling 63 Recommended BIOS/CPU/Memory Test Procedures 63 6.4 Material and Recycling Requirements 63 6.5 Safety Requirements 64 6.6 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design ...... 64 6.7 Reference Attach Mechanism 65
  • Intel E6750 | Design Guidelines - Page 5
    Performance 87 Appendix D Case Temperature Reference Metrology 89 D.1 Objective and Scope 89 D.2 Supporting Test Equipment 89 D.3 Thermal Calibration Design 125 Appendix H Mechanical Drawings 128 Appendix I Intel Enabled Reference Solution Information 146 Thermal and Mechanical Design
  • Intel E6750 | Design Guidelines - Page 6
    Package IHS Load Areas 15 Figure 2-2. Processor Case Temperature Measurement Location 19 Figure 2-3. Example Thermal Profile 20 Figure 3-1. Processor Thermal Characterization Parameter Relationships 28 Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX Heatsink 31 Figure
  • Intel E6750 | Design Guidelines - Page 7
    Figure 7-40. Fan Speed Control 112 Figure 7-41. Temperature Range = 5 °C 113 Figure 7-42. Temperature Range = 10 °C 114 Figure 7-43. On-Die 7-61. Intel® D60188-001 Reference Solution Assembly 143 Figure 7-62. Intel® D60188-001 Reference Solution Heatsink 144 Figure 7-63. Intel® E18764-001
  • Intel E6750 | Design Guidelines - Page 8
    Tables Table 2-1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions 24 Table 2-2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions ... 24 Table 5-1. Balanced Technology Extended (BTX) Type II Reference TMA Performance 42 Table 5-2. Acoustic Targets 43 Table 5-3.
  • Intel E6750 | Design Guidelines - Page 9
    drawing Updated Intel® Boxed Processor Thermal Solutions inlet ambient temperature assumption Added Intel® Pentium® Dual Core processor E2220 specifications Added Intel® Core™2 Duo Desktop processor E4700 specifications Added Intel® Celeron® Dual-Core processor E1400 Added Intel® Celeron® Dual-Core
  • Intel E6750 | Design Guidelines - Page 10
    10 Thermal and Mechanical Design Guidelines
  • Intel E6750 | Design Guidelines - Page 11
    on single processor systems using the Intel® Core™2 Duo processor E6000 and E4000 series, Intel® Pentium® Dual Core processor E2000 series, and Intel® Celeron® DualCore processor E1000 series. The concepts given in this document are applicable to any system form factor. Specific examples used
  • Intel E6750 | Design Guidelines - Page 12
    This design guide supports the following processors: Intel® Core™2 Duo processor with 4 MB cache at Tc-max of 60.1 °C applies to Intel® Core™2 Duo processors E6700, E6600, E6420 and E6320 Intel® Core™2 Duo processor with 4 MB cache at Tc-max of 72.0 °C applies to Intel® Core™2 Duo processors E6850
  • Intel E6750 | Design Guidelines - Page 13
    Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 and E4000 Series Datasheet Intel® Pentium® Dual-Core Desktop Processor E2000 Series Datasheet Intel® Celeron ® Dual-Core Processor E1000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification
  • Intel E6750 | Design Guidelines - Page 14
    The surface mount socket designed to accept the processors in the 775-Land LGA package. Advanced Configuration and Power Interface. Bypass surface. A feature on the processor that attempts to keep the processor die temperature within factory specifications. Thermal Control Circuit: Thermal Monitor
  • Intel E6750 | Design Guidelines - Page 15
    LGA package that interfaces with the motherboard using a LGA775 socket. Refer to the datasheet for detailed mechanical specifications. The processor connects to the motherboard through a land grid array (LGA) surface mount socket. The socket contains 775 contacts arrayed about a cavity in the center
  • Intel E6750 | Design Guidelines - Page 16
    Socket Mechanical Design Guide for further information about the LGA775 socket. The processor package has mechanical load limits that are specified in the processor IHS, it should not exceed the corresponding specification given in the processor datasheet. When a compressive static load is necessary
  • Intel E6750 | Design Guidelines - Page 17
    socket load plate (refer to the LGA775 Socket Mechanical Design Guide for further information). 2.1.2.2 Heatsink Clip Load Requirement The attach mechanism for the heatsink developed to support the processor against fatigue failure of socket solder joint in temperature cycling. It is important
  • Intel E6750 | Design Guidelines - Page 18
    and into the socket is usually minimal. The thermal limits for the processor are the Thermal Profile and TCONTROL. The Thermal Profile defines the maximum case temperature as a function of power being dissipated. TCONTROL is a specification used in conjunction with the temperature reported by the
  • Intel E6750 | Design Guidelines - Page 19
    be designed to manage the processor TDP at an inlet temperature of 35 °C + 0.5 °C = 35.5 °C. The slope of the thermal profile was established assuming a generational improvement in thermal solution performance of the reference design. For an example of Intel® Core™2 Duo processor with 4 MB cache at
  • Intel E6750 | Design Guidelines - Page 20
    compliance to the thermal profile, a measurement of the actual processor power dissipation is required. The measured power is plotted on the Thermal Profile to determine the maximum case temperature. Using the example in Figure 2-3 for the Intel® Core™2 Duo processor with 4 MB cache at Tc-max of 60
  • Intel E6750 | Design Guidelines - Page 21
    power than a part with lower value (farther from 0, e.g., more negative number) of TCONTROL when running the same application. This is achieved in part by using the CA vs. RPM and RPM vs. Acoustics (dBA) performance curves from the Intel BIOS based on values read from a factory configured processor
  • Intel E6750 | Design Guidelines - Page 22
    and placement in the area potentially impacted by the processor heatsink. The height of the heatsink must comply with socket in Appendix H of this design guide. The motherboard primary side height constraints defined in the ATX Specification V2.1 and the microATX Motherboard Interface Specification
  • Intel E6750 | Design Guidelines - Page 23
    reference design structural ingredients is 900 grams. The BTX structural reference component strategy and design is reviewed in depth in the latest version of the Balanced Technology Extended (BTX) System Design Guide. Note: The 550g mass limit for ATX solutions is based on the capabilities of the
  • Intel E6750 | Design Guidelines - Page 24
    Table 2-2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions Boxed Processor for Intel® Core™2 Duo Processor E6000 and E4000 Series, Intel® Pentium® Dual Core Processor E2000 Series, and Intel® Celeron® Dual- Core Processor E1000 Series Heatsink Inlet Temperature 40 °C NOTE
  • Intel E6750 | Design Guidelines - Page 25
    : The local ambient temperature TA at the heatsink, which is a function of chassis design. The thermal design power (TDP) of the processor, and the corresponding Intel® Components using 775-Land LGA Package and LGA775 Socket documentation provides Best Known Methods for all aspects LGA775 socket
  • Intel E6750 | Design Guidelines - Page 26
    Processor Thermal/Mechanical Information § 26 Thermal and Mechanical Design Guidelines
  • Intel E6750 | Design Guidelines - Page 27
    : CA = TC = TA = PD = Case-to-local ambient thermal characterization parameter (°C/W) Processor case temperature (°C) Local ambient temperature in chassis at processor (°C) Processor total power dissipation (W) (assumes all power dissipates through the IHS) The case-to-local ambient thermal
  • Intel E6750 | Design Guidelines - Page 28
    provides an illustration of how one might determine the appropriate performance targets. The example power and temperature numbers used here are not related to any specific Intel processor thermal specifications, and are for illustrative purposes only. 28 Thermal and Mechanical Design Guidelines
  • Intel E6750 | Design Guidelines - Page 29
    integrated systems. The Intel maximum power application enables steady power dissipation on a processor to assist in this testing. This maximum power application is provided by Intel. Local Ambient Temperature Measurement Guidelines The local ambient temperature TA is the temperature of the ambient
  • Intel E6750 | Design Guidelines - Page 30
    housing to evaluate the uniformity of the air temperature at the fan inlet. The thermocouples should be should be populated with significant elements like memory cards, graphic card, and chipset to 1.0 in] away from processor and heatsink as shown in Figure power the fan directly,
  • Intel E6750 | Design Guidelines - Page 31
    Thermal Metrology Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX Heatsink Note: Drawing Not to Scale Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink Note: Drawing Not to Scale Thermal and Mechanical Design Guidelines 31
  • Intel E6750 | Design Guidelines - Page 32
    known standards. When measuring the temperature of a surface that is at a different temperature from the surrounding local ambient air Land LGA processor package for TC measurement. This procedure takes into account the specific features of the 775-Land LGA package and of the LGA775 socket for
  • Intel E6750 | Design Guidelines - Page 33
    reduce processor power consumption. An on-die thermal management feature called Thermal Monitor is available on the processor. It provides a thermal management approach to support the continued increases in processor frequency and performance. By using a highly accurate on-die temperature sensing
  • Intel E6750 | Design Guidelines - Page 34
    Control Circuit portion of the Thermal Monitor must be enabled for the processor to operate within specifications. The Thermal Monitor's TCC, when active, will attempt to lower the processor temperature by reducing the processor power consumption. There are two methods by which TCC can reduce
  • Intel E6750 | Design Guidelines - Page 35
    . Each step will be one VID table entry (i.e. 12.5 mV steps). The processor continues to execute instructions during the voltage transition. Operation at the lower voltage reduces the power consumption of the processor, providing a temperature reduction. Thermal and Mechanical Design Guidelines 35
  • Intel E6750 | Design Guidelines - Page 36
    (model specific register). Enabling the Thermal Control Circuit allows the processor to attempt to maintain a safe operating temperature without the need for special software drivers or interrupt handling routines. When the Thermal Control Circuit has been enabled, processor power consumption will
  • Intel E6750 | Design Guidelines - Page 37
    applications with a high cache hit rate dissipate more processor power than applications that are I/O intensive or have low cache hit rates. The processor TDP is based on measurements of processor power consumption while running various high power applications. This data is used to determine those
  • Intel E6750 | Design Guidelines - Page 38
    specifications could be subject to more frequent activation of the thermal control circuit depending upon ambient air temperature and application power processor processor will automatically shut down when the silicon temperature has exceeded the TCC activation temperature processor the processor than
  • Intel E6750 | Design Guidelines - Page 39
    processors. The BIOS only needs to read the TOFFSET MSR and provide this value to the fan speed control device. Figure 4-3. TCONTROL for Digital Thermal Sensor Thermal Diode Temperature Digital Thermometer Temperature 70 0 60 20 50 Temperature 30 40 Power 775 socket. Intel chipsets beginning
  • Intel E6750 | Design Guidelines - Page 40
    Thermal Management Logic and Thermal Monitor Feature QST), see Chapter 7 and the Intel® Quiet System Technology Configuration and Tuning Manual. Intel has worked with many vendors that provide fan speed control devices to provide PECI host controllers. Please consult the local representative for
  • Intel E6750 | Design Guidelines - Page 41
    described in Section 5.2. The table also includes a TA assumption of 35.5 °C for the Intel reference thermal solution at the processor fan heatsink inlet discussed Section 3.3. The analysis assumes a uniform external ambient temperature to the chassis of 35 °C across the fan inlet, resulting in
  • Intel E6750 | Design Guidelines - Page 42
    acoustics at lower fan inlet temperatures. Using the example in Table 5-2 for the Intel® Core™2 Duo processor with 4 MB cache at Tc-max of 60.1 °C the required fan speed necessary to meet thermal specifications can be controlled by the fan inlet temperature and should comply with the following
  • Intel E6750 | Design Guidelines - Page 43
    the design. The acoustic model is predicting that the power supply fan will be the acoustic limiter. 4. The fan support the processor thermal profile, additional acoustic improvements can be achieved at lower processor workload by using the TCONTROL specifications described in Section 2.2.3. Intel
  • Intel E6750 | Design Guidelines - Page 44
    system. Note: It is likely that at some operating points the fans speed will be driven by the system airflow requirements and not the processor thermal limits. Figure 5-1 shows the effective fan curve for the reference design TMA. These curves are based on analysis. The boundary conditions used are
  • Intel E6750 | Design Guidelines - Page 45
    Thermal Management The BTX TMA is integral to the cooling of the processor voltage regulator (VR). The reference design TMA will include a flow partitioning effective cooling for the voltage regulator (VR) chipset and system memory components on the motherboard. The Thermal Module is required to
  • Intel E6750 | Design Guidelines - Page 46
    that should be delivered to the VR when the VR power is at a maximum in order to support the 775_VR_CONFIG_06 processors at TDP power dissipation and the chassis external environment temperature is at 35 ºC. Less airflow is necessary when the VR power is not at a maximum or if the external ambient
  • Intel E6750 | Design Guidelines - Page 47
    : 5 Hz to 500 Hz 5 Hz @ .001 g2/Hz to 20 Hz @ 0.01 g2/Hz (slope up) 20 Hz to 500 Hz @ 0.01 g2/Hz (flat) Power Spectral Density (PSD) Profile: 2.2 G RMS Figure 5-2. Random Vibration PSD 0.1 0.01 0.001 Vibration System Level + 3 dB Control Limit - 3 dB Control Limit 0.0001 1 10 100 Hz 1000
  • Intel E6750 | Design Guidelines - Page 48
    test should be followed by a visual inspection and then BIOS/CPU/Memory test. 5.2.1.2.2 Post-Test Pass Criteria The post-test pass processor package. 6. Successful BIOS/Processor/memory test of post-test samples. 7. Thermal compliance testing to demonstrate that the case temperature specification
  • Intel E6750 | Design Guidelines - Page 49
    All enabling components, including socket and thermal solution parts Power supply Disk drive Video card DIMM Keyboard Monitor The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors. Material
  • Intel E6750 | Design Guidelines - Page 50
    can be found in Balanced Technology Extended (BTX) System Design Guide available at http://www.formfactors.org. The maximum height of the Specification for Zone A, found at http://www.formfactors.org. Figure 5-4. Intel Type II TMA 65 W Reference Design Development vendor information for the Intel
  • Intel E6750 | Design Guidelines - Page 51
    strategy for the Intel Type II TMA is to minimize upward board deflection during shock to help protect the LGA775 socket. BTX thermal solutions against fatigue failure of socket solder joint. The allowable preload range for BTX platforms is provided in Table 5-4, but the specific target value is a
  • Intel E6750 | Design Guidelines - Page 52
    acceptable domain for Thermal Module assembly effective stiffness and processor preload combinations. The Thermal Module design should have a recommendations are specific to the TMA mounting scheme that meets the BTX Interface Specification and Support Retention Mechanism (SRM) Design Guide. For TMA
  • Intel E6750 | Design Guidelines - Page 53
    15N greater than the values stipulated in Figure 5-6; however, Intel has not conducted any validation testing with this TMA mounting the thermal module pass through the rear holes in the motherboard designated in the socket keep-in Figure 7-50 through Figure 7-54 in Appendix H and screw into the
  • Intel E6750 | Design Guidelines - Page 54
    Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 54 Thermal and Mechanical Design Guidelines
  • Intel E6750 | Design Guidelines - Page 55
    of the heatsink. The thermal technology required for the processor. The processors of Intel® Core™2 Duo processor with 4 MB cache at Tc-max of 60.1 °C, Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 61.4 °C and Intel® Pentium® Dual Core processor E2000 series at Tc-max of 61.4 °C require
  • Intel E6750 | Design Guidelines - Page 56
    - Exploded View The processors of Intel® Core™2 Duo processor with 4 MB / 2 MB cache at Tc-max of 72.0 °C, Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 73.3 °C, Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73.3 °C, and Intel® Celeron® Dual-Core processor E1000 series at
  • Intel E6750 | Design Guidelines - Page 57
    Core Applied by TC-1996 Grease The ATX motherboard keep-out and the height recommendations defined Section 6.6 remain the same for a thermal solution for the processor contact with the energized fan by the user during user servicing. Note: Development vendor information for the reference design is
  • Intel E6750 | Design Guidelines - Page 58
    Reference Heatsink Performance Processor Intel® Core™2 Duo processor with 4 MB / 2 MB cache at Tc-max of 72.0 °C Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 73.3 °C Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73.3 °C Intel® Celeron® Dual-Core processor E1000 series at
  • Intel E6750 | Design Guidelines - Page 59
    Tc-max of 73.3 °C ) 0.65 C/W (Intel Core™2 Duo processor, 4 MB / 2 MB at Tc-max of 72.0 °C) 0.67 C/W (Intel Core™2 Duo processor, 2 MB at Tc-max of 73.3 °C) 0.67 C/W (E2000 series at Tc-max of 73.3 °C) 0.67 C/W (E1000 Series of Tc-max of 73.3 °C) Thermal Design Power, Fan speed limited by the fan
  • Intel E6750 | Design Guidelines - Page 60
    for the processor is met at the targeted altitude. 6.2.4 Heatsink Thermal Validation Intel recommends evaluation of the heatsink within the specific boundary conditions based on the methodology described Section 6.3. Testing is done on bench top test boards at ambient lab temperature. In particular
  • Intel E6750 | Design Guidelines - Page 61
    may differ from your own system requirements. 6.3.1.1 Random Vibration Test Procedure Duration: 10 min/axis, 3 axes Frequency Range: 5 Hz to 500 Hz Power Spectral Density (PSD) Profile: 3.13 G RMS Figure 6-4. Random Vibration PSD 0.1 3.13GRMS (10 minutes per axis) (20, 0.02) (500, 0.02) (5, 0.01
  • Intel E6750 | Design Guidelines - Page 62
    test should be followed by a visual inspection and then BIOS/CPU/Memory test. 6.3.1.2.2 Post-Test Pass Criteria The post-test pass processor package. 6. Successful BIOS/Processor/memory test of post-test samples. 7. Thermal compliance testing to demonstrate that the case temperature specification
  • Intel E6750 | Design Guidelines - Page 63
    All enabling components, including socket and thermal solution parts Power supply Disk drive Video card DIMM Keyboard Monitor The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors. Material
  • Intel E6750 | Design Guidelines - Page 64
    safety feature so that there is no risk of personal injury. Geometric Envelope for Intel Reference ATX Thermal Mechanical Design Figure 7-47, Figure 7-48 and Figure 7-49 found in both ATX Specification V2.1 and microATX Motherboard Interface Specification V1.1 documents. 64 Thermal and Mechanical
  • Intel E6750 | Design Guidelines - Page 65
    upward board deflection during shock to help protect the LGA775 socket. The reference design uses a high clip stiffness that resists reference design is 191.3 N ± 44.5 N [43 lb ± 10 lb]. Note: Intel reserves the right to make changes and modifications to the design as necessary to the reference
  • Intel E6750 | Design Guidelines - Page 66
    design can be used by other 3rd party cooling solutions. The attach mechanism consists of: A metal attach clip that interfaces with the heatsink core, see Appendix H, Figure 7-55 and Figure 7-56 for the component drawings. Four plastic fasteners, see Appendix H, Figure 7-57, Figure 7-58, Figure 7-59
  • Intel E6750 | Design Guidelines - Page 67
    ATX Thermal/Mechanical Design Information Figure 6-8. Critical Parameters for Interfacing to Reference Clip Fan Fin Array Core See Detail A Clip Fin Array 1.6 mm Clip Core Detail A Figure 6-9. Critical Core Dimension 1.00 +/- 0.10 mm 1.00 mm min 38.68 +/- 0.30 mm 36.14 +/- 0.10 mm Gap
  • Intel E6750 | Design Guidelines - Page 68
    ATX Thermal/Mechanical Design Information 68 Thermal and Mechanical Design Guidelines
  • Intel E6750 | Design Guidelines - Page 69
    complete discussion of programming the Intel QST in the ME please consult the Intel® Quiet System Technology (Intel® QST) Configuration and Tuning Manual. Note: Fan speed control algorithms and Intel QST in particular rely on a thermal solution being compliant to the processor thermal profile. It is
  • Intel E6750 | Design Guidelines - Page 70
    memory is sensitive to changes in both the processor heatsink fan and a 2nd fan in the system. By placing a factor in this matrix additional the Intel QST could command the processor based upon the difference between current temperature readings and specific temperature targets. A major advantage of
  • Intel E6750 | Design Guidelines - Page 71
    temperatures are assigned for each temperature sensor. For Intel QST, the TCONTROL for the processor and chipset are to be used as the limit temperature gain Kd = derivative gain The Intel® Quiet System Technology (Intel® QST) Configuration and Tuning Manual provides initial values for the each
  • Intel E6750 | Design Guidelines - Page 72
    shown in Figure 7-3 and listed below: ME system (S0-S1) with Controller Link connected and powered DRAM with Channel A DIMM 0 installed and 2MB reserved for Intel® QST FW execution SPI Flash with sufficient space for the Intel® QST Firmware SST-based thermal sensors to provide board thermal data for
  • Intel E6750 | Design Guidelines - Page 73
    -die thermal diode that is in all of the processors in the 775-land LGA packages shipped before the Intel® Core™2 Duo processor. With the proper configuration information the ME can be accommodate inputs from PECI or SST for the processor socket. Additional SST sensors can be added to monitor system
  • Intel E6750 | Design Guidelines - Page 74
    Fan curve will determine the maximum fan speed as a function of the inlet ambient temperature and by design provides a CA sufficient to meet the thermal profile of the processor. Intel QST, by measuring the processor Digital thermal sensor will command the fan to reduce speed below the VSF curve in
  • Intel E6750 | Design Guidelines - Page 75
    tensile stress is originally created when, after inserting a processor into the socket, the LGA775 socket load plate is actuated. In addition, solder joint shear AND LGA775 socket protection against fatigue failure. Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel® Reference
  • Intel E6750 | Design Guidelines - Page 76
    measured along the socket diagonal. The matching of Faxial required to protect the LGA775 socket solder joint in temperature cycling is used. Table 7-1. Board Deflection Configuration Definitions Configuration Parameter Processor + Socket load plate d_ref yes d_BOL yes d_EOL yes NOTES
  • Intel E6750 | Design Guidelines - Page 77
    LGA775 Socket Heatsink Loading Figure 7-6. Board Deflection Definition d1 d'1 d2 d'2 remain within the static load limits defined in the processor datasheet at all times. 2. Board deflection should not exceed motherboard manufacturer specifications. Thermal and Mechanical Design Guidelines 77
  • Intel E6750 | Design Guidelines - Page 78
    LGA775 Socket Heatsink Loading A.2.4 Board Deflection Metric Implementation Example This section is for increasing amounts of board deflection as the motherboard creeps under exposure to time and temperature. In contrast, the stiffer clips stores very little strain energy, and therefore do
  • Intel E6750 | Design Guidelines - Page 79
    LGA775 Socket Heatsink Loading Figure 7-7. Example: Defining Heatsink Preload Meeting Board Deflection Limit A.2.5 Additional Considerations Intel recommends (Refer to processor datasheet) 2. Board deflection should not exceed motherboard manufacturer specifications. Thermal and Mechanical Design
  • Intel E6750 | Design Guidelines - Page 80
    will collaborate with vendors participating in its third party test house program to evaluate third party solutions. Vendor information now is available in Intel® Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo . § 80 Thermal and Mechanical Design Guidelines
  • Intel E6750 | Design Guidelines - Page 81
    socket Quantify preload degradation under bake conditions. Note: This document reflects the current metrology used by Intel. Intel is continuously exploring new ways to improve metrology. Updates in place during the heatsink installation on the processor and motherboard (Refer to Figure 7-9). The
  • Intel E6750 | Design Guidelines - Page 82
    Heatsink Clip Load Metrology Remarks: Alternate Heatsink Sample Preparation As mentioned above, making sure that the load cells have minimum protrusion out of the heatsink base is paramount to meaningful results. An alternate method to make sure that the test setup will measure loads representative
  • Intel E6750 | Design Guidelines - Page 83
    cell in position during heatsink installation Load cell protrusion (Note: to be optimized depending on assembly stiffness) Figure 7-10. Preload Test Configuration Preload Fixture (copper core with milled out pocket) Load Cells (3x) Thermal and Mechanical Design Guidelines 83
  • Intel E6750 | Design Guidelines - Page 84
    terms of mV/V, a data logger or scanner is required to supply 5 volts DC excitation and read the mV response. An automated model into the load cell's wiring) is also placed in the temperature chamber. The load cells can handle up to 121 °C ( instructions. 84 Thermal and Mechanical Design Guidelines
  • Intel E6750 | Design Guidelines - Page 85
    Temperature Preload Measurement 1. Pre-assemble mechanical components on the board as needed prior to mounting the motherboard on an appropriate support actual heatsink mechanism. 2. Install relevant test vehicle (TTV, processor) in the socket 3. Assemble the heatsink reworked with the load cells to
  • Intel E6750 | Design Guidelines - Page 86
    Heatsink Clip Load Metrology 86 Thermal and Mechanical Design Guidelines
  • Intel E6750 | Design Guidelines - Page 87
    of factors related to the interface between the processor and the heatsink base. Specifically, the bond line thickness, interface material area overall thermal solution. The higher the thermal resistance, the larger the temperature drop is across the interface and the more efficient the thermal
  • Intel E6750 | Design Guidelines - Page 88
    Thermal Interface Management 88 Thermal and Mechanical Design Guidelines
  • Intel E6750 | Design Guidelines - Page 89
    account the specific features of the 775-land LGA package and of the LGA775 socket for which it listed the following table as a convenience to Intel's general customers and the list may be Address 1837 Whipple Road, Hayward, Ca 94544 Supporting Test Equipment To apply the reference thermocouple
  • Intel E6750 | Design Guidelines - Page 90
    in place Omega *,36 gauge, "T" Type (see note 2 for ordering information) Calibration and Control Omega*, stable 0 ºC temperature source for calibration and offset Omega *, temperature source to control and understand meter slope gain 52124 5RMA 49850 18490 Not Available OSK2K1280/5SR TC-TT-T-36-72
  • Intel E6750 | Design Guidelines - Page 91
    calibration of temperature measurement equipment be performed before attempting to perform temperature case measurement. Intel recommends checking the IHS notch to allow the thermocouple wire to be routed under the socket lid. This will protect the thermocouple from getting damaged or pinched when
  • Intel E6750 | Design Guidelines - Page 92
  • Intel E6750 | Design Guidelines - Page 93
  • Intel E6750 | Design Guidelines - Page 94
    processor is installed in the LGA775 socket, the groove is parallel to the socket socket load. A larger groove may cause the IHS to warp under the socket load such that it does not represent the performance of an ungrooved IHS on production packages. Inspect parts for compliance to specifications
  • Intel E6750 | Design Guidelines - Page 95
    turn on the solder block heater, as it can take up to 30 minutes to reach the target temperature of 153 - 155 °C. Note: To avoid damage to the processor ensure the IHS temperature does not exceed 155 °C. As a complement to the written procedure a video Thermocouple Attach Using Solder - Video CD-ROM
  • Intel E6750 | Design Guidelines - Page 96
    Case Temperature Reference Metrology Figure 7-17. Bending the Tip of the Thermocouple D.5.2 Thermocouple Attachment to the IHS 12. Clean groove and IHS with Isopropyl Alcohol (IPA) and a
  • Intel E6750 | Design Guidelines - Page 97
    Case Temperature Reference Metrology Figure 7-19. Thermocouple Bead Placement (A) (B) 16. Place the package under the microscope to continue with process. It is also recommended to use a fixture (like processor tray or a plate) to help holding the unit in place for the rest of the attach process.
  • Intel E6750 | Design Guidelines - Page 98
    Case Temperature Reference Metrology Figure 7-20. Position Bead on the Groove Step Kapton* tape Wire section into the groove to prepare for final bead placement Figure 7-21.
  • Intel E6750 | Design Guidelines - Page 99
    Case Temperature Reference Metrology 18. Place a 3rd piece of tape at the end of the step in the groove as shown in Figure 7-22. This tape will
  • Intel E6750 | Design Guidelines - Page 100
    Case Temperature Reference Metrology Figure 7-24. Applying Flux to the Thermocouple Bead 21. Cut two small pieces of solder 1/16 inch (0.065 inch / 1.5 mm) from the roll
  • Intel E6750 | Design Guidelines - Page 101
    is positioned on the Heater block. Connect the thermocouple to a handheld meter to monitor the heater block temperature. 25. Verify the temperature of the Heater block station has reached 155 °C ±5 °C before you proceed. 26. Connect the thermocouple for the device being soldered to a second
  • Intel E6750 | Design Guidelines - Page 102
    the Heater block onto the IHS. Monitor the device IHS temperature during this step to ensure the maximum IHS temperature is not exceeded. Note: The target IHS temperature during reflow is 150 °C ±3 °C. At no time should the IHS temperature exceed 155 °C during the solder process as damage to the
  • Intel E6750 | Design Guidelines - Page 103
    Case Temperature Reference Metrology Figure 7-28. View Through Lens at Solder Station Figure 7-29. Moving Solder back onto Thermocouple Bead Thermal and Mechanical Design Guidelines 103
  • Intel E6750 | Design Guidelines - Page 104
    Excess Solder 32. Allow the device to cool down. Blowing compressed air on the device can accelerate the cooling time. Monitor the device IHS temperature with a handheld meter until it drops below 50 °C before moving it to the microscope for the final steps 104 Thermal and Mechanical Design
  • Intel E6750 | Design Guidelines - Page 105
    Reference Metrology D.5.4 Cleaning and Completion of Thermocouple Installation 33. Remove the device from the solder station and continue to monitor IHS Temperature with a handheld meter. Place the device under the microscope and remove the three pieces of Kapton* tape with Tweezers, keeping the
  • Intel E6750 | Design Guidelines - Page 106
    Case Temperature Reference Metrology 36. Clean the surface of the IHS with Alcohol and use compressed air to remove any remaining contaminants. 37. Fill the rest of
  • Intel E6750 | Design Guidelines - Page 107
    Case Temperature Reference Metrology Figure 7-35. Removing Excess Adhesive from IHS 39. Using a blade, carefully shave any adhesive that is above the IHS surface (see Figure 7-35).
  • Intel E6750 | Design Guidelines - Page 108
    Case Temperature Reference Metrology 45. Place the device in a tray or bag until it is ready to be used for thermal testing use. D.6 Thermocouple Wire Management When installing the processor into the socket, the thermocouple wire should route under the socket lid, as shown in Figure 7-37. This will
  • Intel E6750 | Design Guidelines - Page 109
    processor thermal solution that meets the thermal profile for the processor. See Section 2.2.2 for the definition of the thermal profile and consult the processor datasheet for the specific in thermal performance versus the inlet temperature to the processor fan heatsink. Determine Thermistor Set
  • Intel E6750 | Design Guidelines - Page 110
    Curve Min. Operating 30 38 Fan Inlet Temperature (°C) E.1.2 Minimum Fan Speed Set Point The the processor voltage regulator, or by functional limits of the fan design. Per the Fan Specification provided to the motor windings is insufficient to support commutation. The fan would turn off at 0%
  • Intel E6750 | Design Guidelines - Page 111
    IO (SIO) with the functionality embedded. Intel has engaged with a number of major temperature when the fan will begin to accelerate in response to the on-die thermal sensor temperature (TLOW). The temperature where the fan is operating at full speed (100% PWM duty cycle). By specification
  • Intel E6750 | Design Guidelines - Page 112
    be vendor specific options that temperature. In extreme cases THERMTRIP# activates and shuts down the processor The first two cases can create a poor acoustic response for the user. The third case the user could notice a drop in performance as the thermal control circuit reduces the power
  • Intel E6750 | Design Guidelines - Page 113
    Legacy Fan Speed Control Figure 7-41. Temperature Range = 5 °C Fan RPM 3500 3000 2500 2000 1500 1000 accelerate at a lower TSENSOR reading the thermal solution can keep up with rate of change in processor power. The rate of change in acoustics (dBA) is more linear with RPM. When comparing these two
  • Intel E6750 | Design Guidelines - Page 114
    that having TSENSOR above TCONTROL is expected for workloads near TDP power levels and high system ambient. See Section E.4 for additional discussion on TCONTROL versus Thermal Profile For use with the ATX Boxed Processor enabled reference solution a TRANGE value of 10 °C is recommended. For BTX
  • Intel E6750 | Design Guidelines - Page 115
    34 38 Inlet Temperature (°C) Interaction of Thermal Profile and TCONTROL The processor thermal specification is comprised Intel requires monitoring the on-die thermal sensor to implement acoustic fan speed control. The value of the on-die thermal sensor temperature determines which specification
  • Intel E6750 | Design Guidelines - Page 116
    Specification for 4 wire PWM Controlled Fans and Chapter 6 for complete details on the Intel enabled thermal solution. The basics of Fan Speed Control were discussed in Chapter 7, as a review TAVERAGING Temperature reported from the processor on-die thermal sensor. TCONTROL is the specification
  • Intel E6750 | Design Guidelines - Page 117
    part of the design necessary to meet specifications. Should be considered a pass or the Boxed Processor. External/remote thermal sensor measurement capability (required). Must support PECI and thermal provisions within the BIOS setup or other utility to input the corrections factors. The BIOS, at a
  • Intel E6750 | Design Guidelines - Page 118
    of 25 kHz is the design target for the reference and for the Intel® Boxed Processor and the reference design. 2. Use the lowest time available in this range for the device selected. 3. To ensure compliance with the thermal specification, thermal profile and usage of the TSENSOR for fan speed control
  • Intel E6750 | Design Guidelines - Page 119
    Intel® Boxed Processor and BTX reference design. 2. Use the lowest time available in this range for the device selected. 3. TAVERAGING = represents the amount of delay time before responding to the temperature compliance with the thermal specification, thermal profile and usage by the BIOS writer to
  • Intel E6750 | Design Guidelines - Page 120
    Legacy Fan Speed Control 120 Thermal and Mechanical Design Guidelines
  • Intel E6750 | Design Guidelines - Page 121
    anticipated system operating conditions in which the processor power may be low but other system component powers may be high. If the only Fan , or near memory. The final system integrator is typically responsible for ensuring compliance with the component temperature specifications at all operating
  • Intel E6750 | Design Guidelines - Page 122
    . Lisle, IL 60532 1-800-78MOLEX phone 1-630-969-1352 fax [email protected] Figure 7-45. System Airflow Illustration with System Monitor Point Area Identified Power Supply Unit Graphics Add-In Card Memory Monitor Point MCH Thermal Module OM16791 122 Thermal and Mechanical Design Guidelines
  • Intel E6750 | Design Guidelines - Page 123
    Balanced Technology Extended (BTX) System Thermal Considerations Figure 7-46. Thermal sensor Location Illustration Thermal Sensor MCH Heatsink § Thermal and Mechanical Design Guidelines 123
  • Intel E6750 | Design Guidelines - Page 124
    Balanced Technology Extended (BTX) System Thermal Considerations 124 Thermal and Mechanical Design Guidelines
  • Intel E6750 | Design Guidelines - Page 125
    for Reference Design The fan power requirements for proper operation short circuit current) VIL = 0.8 V RPM must be within spec for specified duty cycle In addition to comply with overall thermal minutes off, at a temperature of 70 °C. See the Fan Specification for 4-wire PWM Controlled Fans for
  • Intel E6750 | Design Guidelines - Page 126
    Fan Performance for Reference Design § 126 Thermal and Mechanical Design Guidelines
  • Intel E6750 | Design Guidelines - Page 127
    Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 127
  • Intel E6750 | Design Guidelines - Page 128
    lists the mechanical drawings included in this appendix. These drawings refer to the reference thermal mechanical enabling components for the processor. Note: Intel reserves the right to make changes and modifications to the design as necessary. Drawing Description ATX/µATX Motherboard Keep-out
  • Intel E6750 | Design Guidelines - Page 129
    39.01 36.00 33.00 32.51 27.51 ( 16.87 ) 27.51 32.51 36.00 39.01 47.50 45.26 44.00 40.00 36.78 36.49 27.00 23.47 5.90 0.00 2 7.30 23.47 27.81 36.78 40.00 45.26 47.50
  • Intel E6750 | Design Guidelines - Page 130
  • Intel E6750 | Design Guidelines - Page 131
  • Intel E6750 | Design Guidelines - Page 132
  • Intel E6750 | Design Guidelines - Page 133
  • Intel E6750 | Design Guidelines - Page 134
  • Intel E6750 | Design Guidelines - Page 135
  • Intel E6750 | Design Guidelines - Page 136
  • Intel E6750 | Design Guidelines - Page 137
  • Intel E6750 | Design Guidelines - Page 138
  • Intel E6750 | Design Guidelines - Page 139
  • Intel E6750 | Design Guidelines - Page 140
  • Intel E6750 | Design Guidelines - Page 141
  • Intel E6750 | Design Guidelines - Page 142
  • Intel E6750 | Design Guidelines - Page 143
  • Intel E6750 | Design Guidelines - Page 144
  • Intel E6750 | Design Guidelines - Page 145
    DWG. NO. SH. 1 REV.
  • Intel E6750 | Design Guidelines - Page 146
    components. The part numbers listed in the tables identify these reference components. End-users are responsible for the verification of the Intel enabled component offerings with the supplier. OEMs and System Integrators are responsible for thermal, mechanical, and environmental validation of these
  • Intel E6750 | Design Guidelines - Page 147
    .Chen@Foxcon n.com 847-2992222 [email protected] om Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of
  • Intel E6750 | Design Guidelines - Page 148
    Intel Enabled Reference Solution Information Table 7-10. Balanced Technology Extended (BTX) Reference Thermal Solution Providers Supplier Part Description Part Number Contact Phone Notes Mitac International Corp Support and Retention Module _ Michael Tsai 886-3-328-9000 1 Ext.6545 AVC
  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
  • 105
  • 106
  • 107
  • 108
  • 109
  • 110
  • 111
  • 112
  • 113
  • 114
  • 115
  • 116
  • 117
  • 118
  • 119
  • 120
  • 121
  • 122
  • 123
  • 124
  • 125
  • 126
  • 127
  • 128
  • 129
  • 130
  • 131
  • 132
  • 133
  • 134
  • 135
  • 136
  • 137
  • 138
  • 139
  • 140
  • 141
  • 142
  • 143
  • 144
  • 145
  • 146
  • 147
  • 148
Document Number:
317804-011
Intel
®
Core
™
2 Duo Processor,
Intel
®
Pentium
®
Dual Core
Processor, and Intel
®
Celeron
®
Dual-Core Processor
Thermal and Mechanical Design Guidelines
Supporting the:
- Intel
®
Core™2 Duo Processor E6000
and E4000
Series
- Intel
®
Pentium
®
Dual Core Processor E2000
Series
- Intel
®
Celeron
®
Dual-Core Processor E1000
Series
June 2009