Xerox 7300N Service Manual - Page 7

Electrostatic Discharge ESD Precautions - no power

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Electrostatic Discharge (ESD) Precautions Some semiconductor components, and the respective sub-assemblies that contain them, are vulnerable to damage by electrostatic discharge (ESD). These components include integrated circuits (ICs), Large-Scale Integrated circuits (LSIs), field-effect transistors and other semiconductor chip components. The following techniques will reduce the occurrence of component damage caused by static electricity: Caution: Be sure the power is off and observe all other safety precautions. ■ Immediately before handling any semiconductor component assemblies, drain the electrostatic charge from your body. This can be accomplished by touching an earth ground source or by wearing a wrist strap device connected to an earth ground source. Wearing a wrist strap will also prevent accumulation of additional bodily static charges. (Be sure to remove the wrist strap before applying power to the unit under test to avoid potential shock.) ■ After removing a static sensitive assembly from it's anti-static bag, place it on a grounded conductive surface such as aluminum foil. If the anti-static bag is conductive, you may ground the bag and use it as a conductive surface. ■ Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage some devices. ■ Do not remove a replacement component or electrical sub-assembly from its protective package until you are ready to install it. ■ Immediately before removing the protective material from the leads of a replacement device, touch the protective material to the chassis or circuit assembly into which the device will be installed. ■ Minimize body motions when handling unpackaged replacement devices. Motion such as your clothes brushing together, or lifting a foot from a carpeted floor can generate enough static electricity to damage an electro-statically sensitive device ■ Handle IC's and EEPROM's carefully to avoid bending pins. ■ Pay attention to the direction of parts when mounting or inserting them on Printer Circuit Boards (PCB's). v

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v
Electrostatic Discharge (ESD) Precautions
Some semiconductor components, and the respective sub-assemblies that contain
them, are vulnerable to damage by electrostatic discharge (ESD). These components
include integrated circuits (ICs), Large-Scale Integrated circuits (LSIs), field-effect
transistors and other semiconductor chip components. The following techniques will
reduce the occurrence of component damage caused by static electricity:
Caution:
Be sure the power is off and observe all other safety
precautions.
Immediately before handling any semiconductor component assemblies,
drain the electrostatic charge from your body. This can be accomplished by
touching an earth ground source or by wearing a wrist strap device
connected to an earth ground source. Wearing a wrist strap will also
prevent accumulation of additional bodily static charges. (Be sure to
remove the wrist strap before applying power to the unit under test to avoid
potential shock.)
After removing a static sensitive assembly from it’s anti-static bag, place it
on a grounded
conductive surface such as aluminum foil. If the anti-static
bag is conductive, you may ground the bag and use it as a conductive
surface.
Do not use freon-propelled chemicals. These can generate electrical charges
sufficient to damage some devices.
Do not remove a replacement component or electrical sub-assembly from its
protective package until you are ready to install it.
Immediately before removing the protective material from the leads of a
replacement device, touch the protective material to the chassis or circuit
assembly into which the device will be installed.
Minimize body motions when handling unpackaged replacement devices.
Motion such as your clothes brushing together, or lifting a foot from a
carpeted floor can generate enough static electricity to damage an
electro-statically sensitive device
Handle IC’s and EEPROM’s carefully to avoid bending pins.
Pay attention to the direction of parts when mounting or inserting them on
Printer Circuit Boards (PCB’s).