Dell PowerEdge T40 EMC Technical Specifications Guide - Page 13

Particulate and gaseous contamination specifications

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Ambient Card 25°C 30°C 35°C NOTE: The PowerEdge T40 does not support enterprise-class drives. Limited to Tier 2 PCIe cards Or PCIe cards do not require system level cooling assistance up to a local ambient temperature of 55°C Particulate and gaseous contamination specifications Table 17. Particulate contamination specifications Particulate contamination Specifications Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: This condition applies to data center and non-data center environments. Corrosive dust Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE: This condition applies to data center and non-data center environments. Table 18. Gaseous contamination specifications Gaseous contamination Copper coupon corrosion rate Silver coupon corrosion rate Specifications

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Ambient
25°C
30°C
35°C
NOTE:
The PowerEdge T40 does not support enterprise-class drives.
Card
Limited to Tier 2 PCIe cards
Or
PCIe cards do not require system level cooling assistance up to a local ambient temperature of 55°C
Particulate and gaseous contamination specifications
Table 17. Particulate contamination specifications
Particulate contamination
Specifications
Air filtration
Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence
limit.
NOTE:
This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment
designed to be used outside a data center, in environments such as an office or factory floor.
NOTE:
Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust
Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE:
This condition applies to data center and non-data center environments.
Corrosive dust
Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE:
This condition applies to data center and non-data center environments.
Table 18. Gaseous contamination specifications
Gaseous contamination
Specifications
Copper coupon corrosion rate
<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate
<200 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
NOTE:
Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Technical specifications
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