HP Cluster Platform Introduction v2010 HP Cluster Platform Server and Workstat - Page 200
HP ProLiant BL685c System Board Components
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Figure 4-38 HP ProLiant BL685c System Board Components 2 1 34 5 6 7 8 9 10 11 26 25 12 13 14 24 23 22 21 20 19 18 17 15 16 The following list describes the callouts in Figure 4-38: 1. Bezel LED connector 2. Processor socket 4 3. DIMM slots (Processor 4 memory banks G and H) 4. Processor socket 2 (populated) 5. DIMM slots (Processor 2 memory banks C and D) 6. Internal USB connector 7. Embedded dual-port NIC 8. Mezzanine connector 2 (Type I or Type II mezzanine) 9. Mezzanine connector 1 (Type I mezzanine only) 10. Enclosure connector 1 11. System board thumbscrew 12. Mezzanine connector 3 (Type I or Type II mezzanine) 13. Enclosure connector 2 14. System board thumbscrew 15. Embedded NIC 16. Embedded NIC 17. Smart Array E200i cache module (under mezzanine card 3) 18. SAS cable 19. Processor socket 1 (populated) 20. DIMM slots (Processor 1 memory banks A and B) 21. System battery 22. DIMM slots (Processor 3 memory banks E and F) 23. Processor socket 3 200 Server Blades