HP Mini 1125NR HP Mini 1000 Netbook - Maintenance and Service Guide - Page 60

and the heat sink

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2. Remove the heat sink assembly (2). NOTE: Due to the adhesive quality of the thermal material located between the heat sink assembly and system board components, it may be necessary to move the heat sink assembly from side to side to detach the assembly. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink assembly and the system board each time the heat sink assembly is removed. Thermal paste is used on the processor (1), the heat sink section (2) that services the processor, the Northbridge chip (3), and the heat sink section (4) that services the Northbridge chip. Replacement thermal material is included with all heat sink assembly and system board spare part kits. Reverse this procedure to install the heat sink assembly. 52 Chapter 4 Removal and replacement procedures

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2.
Remove the heat sink assembly
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink
assembly and system board components, it may be necessary to move the heat sink assembly
from side to side to detach the assembly.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink
assembly and the system board each time the heat sink assembly is removed. Thermal paste is
used on the processor
(1)
, the heat sink section
(2)
that services the processor, the Northbridge
chip
(3)
, and the heat sink section
(4)
that services the Northbridge chip. Replacement thermal
material is included with all heat sink assembly and system board spare part kits.
Reverse this procedure to install the heat sink assembly.
52
Chapter 4
Removal and replacement procedures