HP Pavilion 14-v200 Pavilion 14 Notebook PC Maintenance and Service Guide - Page 75

steps 5 through 7 for heat sink assembly removal information for computer models equipped with UMA

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a. Service door (see Service door on page 38) b. Optical drive (see Optical drive on page 40) c. Top cover (see Top cover on page 47) d. System board (see System board on page 57) e. Fan (see Fan on page 63) Remove the heat sink assembly: 1. Turn the system board upside down, with the front toward you. NOTE: Steps 2 through 4 apply to computer models equipped with switchable discrete graphics. See steps 5 through 7 for heat sink assembly removal information for computer models equipped with UMA graphics. 2. Remove the four Phillips M2.5x4.0 screws (1) and the three Phillips PM2.5x4.0 screws (2) that secure the heat sink assembly to the system board. 3. Remove the heat sink assembly (3) from the system board. NOTE: Due to the adhesive quality of the thermal material located between the heat sink assembly and the system board components, it may be necessary to move the heat sink assembly from side to side to detach it. 4. Remove the thermal material. The thermal material must be thoroughly cleaned from the surfaces of the heat sink assembly and the system board components each time the heat sink assembly is removed. Replacement thermal material is included with the heat sink assembly and system board spare part kits. ● Thermal paste is used on the processor (1) and the heat sink assembly section (2) that services it ● Thermal paste is used on the graphics subsystem chip (3) and the heat sink assembly section (4) that services it Component replacement procedures 65

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a.
Service door (see
Service door
on page
38
)
b.
Optical drive (see
Optical drive
on page
40
)
c.
Top cover (see
Top cover
on page
47
)
d.
System board (see
System board
on page
57
)
e.
Fan (see
Fan
on page
63
)
Remove the heat sink assembly:
1.
Turn the system board upside down, with the front toward you.
NOTE:
Steps 2 through 4 apply to computer models equipped with switchable discrete graphics. See
steps 5 through 7 for heat sink assembly removal information for computer models equipped with UMA
graphics.
2.
Remove the four Phillips M2.5x4.0 screws
(1)
and the three Phillips PM2.5x4.0 screws
(2)
that secure
the heat sink assembly to the system board.
3.
Remove the heat sink assembly
(3)
from the system board.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink assembly
and the system board components, it may be necessary to move the heat sink assembly from side to
side to detach it.
4.
Remove the thermal material. The thermal material must be thoroughly cleaned from the surfaces of
the heat sink assembly and the system board components each time the heat sink assembly is
removed. Replacement thermal material is included with the heat sink assembly and system board
spare part kits.
●
Thermal paste is used on the processor
(1)
and the heat sink assembly section
(2)
that services it
●
Thermal paste is used on the graphics subsystem chip
(3)
and the heat sink assembly section
(4)
that services it
Component replacement procedures
65