HP Pavilion dm4-2000 HP Pavilion dm4 Entertainment PC - Maintenance and Servic - Page 84
The following illustration shows the locations for thermal material on systems with discrete
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4. Remove the fan/heat sink assembly (2). The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly (1), the processor (2) and the graphics processor (3) on the system board each time the fan/heat sink assembly is removed. Thermal pads and thermal paste must be installed on all surfaces before the fan/heat sink assembly is reinstalled. The following illustration shows the locations for thermal material on systems with discrete graphics subsystems. NOTE: Steps 5 through 7 apply to computers with UMA subsystem memory on the system board. Steps 1 through 4 apply to computers with discrete subsystem memory. 76 Chapter 4 Removal and replacement procedures
4.
Remove the fan/heat sink assembly
(2)
.
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly
(1)
, the processor
(2)
and the graphics processor
(3)
on the system board each time
the fan/heat sink assembly is removed. Thermal pads and thermal paste must be installed on all
surfaces before the fan/heat sink assembly is reinstalled.
The following illustration shows the locations for thermal material on systems with discrete
graphics subsystems.
NOTE:
Steps 5 through 7 apply to computers with UMA subsystem memory on the system
board. Steps 1 through 4 apply to computers with discrete subsystem memory.
76
Chapter 4
Removal and replacement procedures