Home » Intel Manuals » Motherboards » Intel BLKD945GCLF2D » Manual Viewer

Intel BLKD945GCLF2D Product Specification - Page 54

Reliability, Environmental

View all Intel BLKD945GCLF2D manuals

Add to My Manuals
Save this manual to your list of manuals

Page 54 highlights

Intel Desktop Board D945GCLF2 Technical Product Specification 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the Intel Desktop Board D945GCLF2 is 75,716.67728 hours and for the Intel Desktop Board D945GCLF2D the MTBF is 76,277.65065 hours. 2.8 Environmental Table 25 lists the environmental specifications for the board. Table 25. Intel Desktop Board D945GCLF2 Environmental Specifications Parameter Specification Temperature Non-Operating Operating Shock Unpackaged Packaged Vibration Unpackaged Packaged -20 °C to +70 °C 0 °C to +55 °C 50 g trapezoidal waveform Velocity change of 170 inches/second² Half sine 2 millisecond Product weight (pounds) Free fall (inches)

Section	Page
Intel® Desktop Board D945GCLF2 Technical Product Specification	1
Revision History	2
Preface	3
Intended Audience	3
What This Document Contains	3
Typographical Conventions	3
Contents	5
1 Product Description	9
1.1 Overview	9
1.1.1 Feature Summary	9
1.1.2 Board Layout	11
1.1.3 Block Diagram	13
1.2 Legacy Considerations	14
1.3 Online Support	14
1.4 Processor	14
1.5 System Memory	15
1.6 Intel® 945GC Chipset	16
1.6.1 Intel 945GC Graphics Subsystem	16
1.6.2 USB	18
1.6.3 IDE Support	18
1.7 Real-Time Clock Subsystem	19
1.8 S-Video Output	20
1.9 Legacy I/O Controller	20
1.9.1 Serial Port	20
1.9.2 Parallel Port	20
1.9.3 Keyboard and Mouse Interface	21
1.10 Audio Subsystem	22
1.10.1 Audio Subsystem Software	23
1.10.2 Audio Connectors and Headers	23
1.11 LAN Subsystem	24
1.11.1 LAN Subsystem Software	24
1.11.2 RJ-45 LAN Connector with Integrated LEDs	25
1.12 Hardware Management Subsystem	26
1.12.1 Hardware Monitoring	26
1.12.2 Thermal Monitoring	27
1.13 Power Management	28
1.13.1 ACPI	28
1.13.2 Hardware Support	31
1.13.3 ENERGY STAR*	35
2 Technical Reference	37
2.1 Memory Map	37
2.1.1 Addressable Memory	37
2.2 Connectors and Headers	40
2.2.1 Back Panel Connectors	41
2.2.2 Component-side Connectors and Headers	42
2.3 Jumper Block	49
2.4 Mechanical Considerations	50
2.4.1 Form Factor	50
2.5 Electrical Considerations	51
2.5.1 Power Supply Considerations	51
2.5.2 Fan Header Current Capability	51
2.5.3 Add-in Board Considerations	52
2.6 Thermal Considerations	52
2.7 Reliability	54
2.8 Environmental	54
3 Overview of BIOS Features	55
3.1 Introduction	55
3.2 BIOS Flash Memory Organization	56
3.3 Resource Configuration	56
3.3.1 PCI* Autoconfiguration	56
3.4 System Management BIOS (SMBIOS)	57
3.5 Legacy USB Support	58
3.6 BIOS Updates	59
3.6.1 Language Support	59
3.6.2 Custom Splash Screen	59
3.7 BIOS Recovery	60
3.8 Boot Options	61
3.8.1 CD-ROM Boot	61
3.8.2 Network Boot	61
3.8.3 Booting Without Attached Devices	61
3.8.4 Changing the Default Boot Device During POST	61
3.9 Adjusting Boot Speed	62
3.9.1 Peripheral Selection and Configuration	62
3.9.2 BIOS Boot Optimizations	62
3.10 BIOS Security Features	63
4 Error Messages and Beep Codes	65
4.1 BIOS Front-panel Power LED Codes	65
4.2 BIOS Beep Codes	66
4.3 BIOS Error Messages	66
4.4 Port 80h POST Codes	67
5 Regulatory Compliance and Battery Disposal Information	73
5.1 Regulatory Compliance	73
5.1.1 Safety Standards	73
5.1.2 European Union Declaration of Conformity Statement	74
5.1.3 Product Ecology Statements	75
5.1.4 EMC Regulations	79
5.1.5 Product Certification Markings (Board Level)	80