Intel D425KT Product Specification - Page 5

Contents, Product Description, Technical Reference - overview

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Contents 1 Product Description 9 1.1 Overview 9 1.1.1 Feature Summary 9 1.1.2 Board Layout 11 1.1.3 Block Diagram 13 1.2 Online Support 14 1.3 Processor 14 1.3.1 Intel D425 Graphics Subsystem 15 1.4 System Memory 16 1.5 Intel® NM10 Express Chipset 17 1.5.2 USB 19 1.5.3 SATA Support 19 1.6 Real-Time Clock Subsystem 20 1.7 Legacy I/O Controller 20 1.8 LAN Subsystem 21 1.8.1 LAN Subsystem Drivers 21 1.8.2 RJ-45 LAN Connector with Integrated LEDs 22 1.9 Audio Subsystem 23 1.9.1 Audio Subsystem Software 24 1.9.2 Audio Connectors and Headers 24 1.10 Hardware Management Subsystem 25 1.10.1 Hardware Monitoring 25 1.10.2 Thermal Monitoring 26 1.11 Power Management 27 1.11.1 ACPI 27 1.11.2 Hardware Support 30 2 Technical Reference 33 2.1 Memory Map 33 2.1.1 Addressable Memory 33 2.2 Connectors and Headers 36 2.2.1 Back Panel 37 2.2.2 Component-side Connectors and Headers 39 2.3 BIOS Configuration Jumper Block 49 2.4 Mechanical Considerations 51 2.4.1 Form Factor 51 2.5 Electrical Considerations 52 2.5.1 Fan Header Current Capability 52 2.5.2 Add-in Board Considerations 52 2.6 Thermal Considerations 52 2.6.1 Passive Heatsink Design in a Passive System Environment ......... 54 v

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Contents
1
Product Description
..............................................................
9
1.1
Overview
..........................................................................................
9
1.1.1
Feature Summary
..................................................................
9
1.1.2
Board Layout
.......................................................................
11
1.1.3
Block Diagram
.....................................................................
13
1.2
Online Support
................................................................................
14
1.3
Processor
.......................................................................................
14
1.3.1
Intel D425 Graphics Subsystem
..............................................
15
1.4
System Memory
..............................................................................
16
1.5
Intel
®
NM10 Express Chipset
.............................................................
17
1.5.2
USB
...................................................................................
19
1.5.3
SATA Support
......................................................................
19
1.6
Real-Time Clock Subsystem
..............................................................
20
1.7
Legacy I/O Controller
.......................................................................
20
1.8
LAN Subsystem
...............................................................................
21
1.8.1
LAN Subsystem Drivers
.........................................................
21
1.8.2
RJ-45 LAN Connector with Integrated LEDs
..............................
22
1.9
Audio Subsystem
.............................................................................
23
1.9.1
Audio Subsystem Software
....................................................
24
1.9.2
Audio Connectors and Headers
...............................................
24
1.10
Hardware Management Subsystem
....................................................
25
1.10.1
Hardware Monitoring
.............................................................
25
1.10.2
Thermal Monitoring
..............................................................
26
1.11
Power Management
.........................................................................
27
1.11.1
ACPI
...................................................................................
27
1.11.2
Hardware Support
................................................................
30
2
Technical Reference
............................................................
33
2.1
Memory Map
...................................................................................
33
2.1.1
Addressable Memory
.............................................................
33
2.2
Connectors and Headers
...................................................................
36
2.2.1
Back Panel
..........................................................................
37
2.2.2
Component-side Connectors and Headers
................................
39
2.3
BIOS Configuration Jumper Block
.......................................................
49
2.4
Mechanical Considerations
................................................................
51
2.4.1
Form Factor
.........................................................................
51
2.5
Electrical Considerations
...................................................................
52
2.5.1
Fan Header Current Capability
................................................
52
2.5.2
Add-in Board Considerations
..................................................
52
2.6
Thermal Considerations
....................................................................
52
2.6.1
Passive Heatsink Design in a Passive System Environment
.........
54