Intel DH57JG Product Specification - Page 57

Table 30., Thermal Considerations for Components, Table 31., Tcontrol Values for Components

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Technical Reference Table 30 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 30. Thermal Considerations for Components Component Maximum Case Temperature Processor For processor case temperature, see processor datasheets and processor specification updates Intel H57 Express Chipset 111 oC To ensure functionality and reliability, the component is specified for proper operation when Case Temperature is maintained at or below the maximum temperature listed in Table 30. This is a requirement for sustained power dissipation equal to Thermal Design Power (TDP is specified as the maximum sustainable power to be dissipated by the components). When the component is dissipating less than TDP, the case temperature should be below the Maximum Case Temperature. The surface temperature at the geometric center of the component corresponds to Case Temperature. It is important to note that the temperature measurement in the system BIOS is a value reported by embedded thermal sensors in the components and does not directly correspond to the Maximum Case Temperature. The upper operating limit when monitoring this thermal sensor is Tcontrol, as shown in Table 31. Table 31. Tcontrol Values for Components Component Tcontrol Processor For processor case temperature, see processor datasheets and processor specification updates Intel H57 Express Chipset 107 oC For information about Processor datasheets and specification updates Refer to Section 1.3, page 14 57

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Technical Reference
57
Table 30 provides maximum case temperatures for the components that are sensitive
to thermal changes.
The operating temperature, current load, or operating frequency
could affect case temperatures.
Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 30.
Thermal Considerations for Components
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel H57 Express Chipset
111
o
C
To ensure functionality and reliability, the component is specified for proper operation
when Case Temperature is maintained at or below the maximum temperature listed in
Table 30. This is a requirement for sustained power dissipation equal to Thermal
Design Power (TDP is specified as the maximum sustainable power to be dissipated by
the components). When the component is dissipating less than TDP, the case
temperature should be below the Maximum Case Temperature. The surface
temperature at the geometric center of the component corresponds to Case
Temperature.
It is important to note that the temperature measurement in the system BIOS is a
value reported by embedded thermal sensors in the components and does not directly
correspond to the Maximum Case Temperature. The upper operating limit when
monitoring this thermal sensor is Tcontrol, as shown in Table 31.
Table 31.
Tcontrol Values for Components
Component
Tcontrol
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel H57 Express Chipset
107
o
C
For information about
Refer to
Processor datasheets and specification updates
Section 1.3, page 14