Intel E7500 Design Guide - Page 20

Thermal Metrology R 5.2 Power Simulation Software The power simulation software is a utility designed to dissipate the thermal design power on a MCH when used in conjunction with an Intel® Xeon™ processor with 512-KB L2 cache. The combination of the Intel® Xeon™ processor with 512-KB L2 cache and the higher bandwidth capability of the E7500 chipset enables new levels of system performance. To assess the thermal performance of an MCH thermal solution under "worst-case realistic application" conditions, Intel has developed a software utility that operates the chipset at near worst-case power dissipation. The utility has been developed solely for testing customer thermal solutions at near the thermal design power. Figure 7 shows a decision flowchart for determining thermal solution needs. Real future applications may exceed the thermal design power limit for transient time periods. For power supply current requirements under these transient conditions, refer to each component's datasheet for the ICC (Max Power Supply Current) specification. Contact your Intel Field Sales representative to obtain a copy of this software. Figure 7. Thermal Solution Decision Flowchart Start Attach device to board using normal reflow process Attach thermocouples using recommended methodology. Setup the system in the desired configuation. Run the power program and monitor the device die temperature. Select heatsink Heatsink requied Tdie > No Specification? Yes End Therm_Flowchart 20 Intel® E7500 MCH Thermal and Mechanical Design Guidelines