Intel E7500 Design Guide - Page 30

Reference Thermal Solutions R 6.4 Reliability Requirements Each motherboard, heatsink and attach combination may vary the mechanical loading of the component. The user should carefully evaluate the reliability of the completed assembly prior to use in high volume. Some general recommendations are shown in Table 2. Table 2. Reliability Requirements Test Requirement Pass/Fail Criteria Mechanical Shock Random Vibration Temperature Life Thermal Cycling Humidity 50 g, board level, 11 msec, 3 shocks/axis 7.3 g, board level, 45 min/axis, 50 Hz to 2000 Hz 85 °C, 2000 hours total, checkpoints at 168, 500, 1000, and 2000 hours -5 °C to +70 °C, 500 cycles 85% relative humidity, 55 °C, 1000 hours Visual Check and Electrical Functional Test Visual Check and Electrical Functional Test Visual Check Visual Check Visual Check NOTES: 1. The tests should be performed on a sample size of at least 12 assemblies from 3 lots of material. 2. Additional Pass/Fail Criteria may be added at the discretion of the user. 30 Intel® E7500 MCH Thermal and Mechanical Design Guidelines