Intel E7500 Design Guide - Page 3

R Contents 1 Introduction ...7 1.1 Design Flow ...8 1.2 Definition of Terms 9 1.3 Reference Documents 10 2 Packaging Technology ...11 3 Thermal Simulation...13 4 Thermal Specifications ...15 4.1 Power ...15 4.2 Die Temperature 15 5 Thermal Metrology...17 5.1 Die Temperature Measurements 17 5.1.1 90° Angle Attach Methodology 17 5.1.2 0° Angle Attach Methodology 18 5.2 Power Simulation Software 20 6 Reference Thermal Solutions 21 6.1 Operating Environment 21 6.2 Mechanical Design Envelope 21 6.3 Thermal Solution Assembly 23 6.3.1 Heatsink Orientations 25 6.3.2 Extruded Heatsink Profiles 26 6.3.3 Mechanical Interface Material 27 6.3.4 Thermal Interface Material 27 6.3.5 Heatsink Clip 27 6.3.6 Clip Retention Anchors 28 6.3.7 Board Level Component Keep-out Dimensions 28 6.4 Reliability Requirements 30 Appendix A: Thermal Solution Component Suppliers 31 Appendix B: Mechanical Drawings...33 Intel® E7500 MCH Thermal and Mechanical Design Guidelines 3