Intel SE7320SP2 User Guide - Page 22

Hardware Requirements, Processor, Memory, Power Supply

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Hardware Requirements To avoid integration difficulties and possible board damage, your system must meet the requirements outlined below. For a list of qualified components see the links under "Additional Information and Software." Processor Both the SE7320SP2 and SE7525GP2 server boards are designed to support one or two Intel® Xeon™ processors utilizing an 800 MHz front side bus with frequencies starting at 2.8 GHz. Previous generations of the Xeon processor are not supported for use on server boards SE7320SP2 and SE7525GP2. Both server boards are designed to provide up to 120A of current per processor. Processors with higher current requirements are not supported. For a complete list of supported processors, see the links under "Additional Information and Software." Memory The Server Boards SE7320SP2 and SE7525GP2 each provide four DDR266 / DDR333 DIMM sites in two DIMM banks. The maximum memory capacity is 8GB for either DDR266 or DDR333 memory. Memory DIMM technologies supported are: 128Mb, 256Mb, 512Mb, 1Gb and 2Gb. Memory sizing and configuration is guaranteed only for qualified DIMMs approved by Intel. For a complete list of supported DIMMs, see the links under "Additional Information and Software." The minimum memory configuration is one DIMM, installed in DIMM socket 1B (the socket farthest from the processors). However, for optimum performance and dual-channel interleave operation, a minimum of two DIMMs should be installed. DIMMs on channel A are paired with DIMMs on channel B to configure 2-way interleaving. Both DIMMS in Bank 1 (DIMM1B and DIMM1A) must be populated before any DIMMs are installed in Bank 2 (DIMM2B and DIMM2A). Bank 2 must be populated in pairs. Both DIMMs in a bank must be identical (same manufacturer, CAS latency, number of rows, columns and devices, timing parameters etc.). Although DIMMs within a bank must be identical, the BIOS supports various DIMM sizes and configurations allowing the banks of memory to be different. The mixing of DDR266 and DDR333 memory is supported on the Server Boards SE7320SP2 and SE7525GP2. However, when mixing DIMM types, DDR333 will be treated as DDR266. Power Supply A minimum of 600 Watts is required. Your supply must provide a minimum of 2.0 A of 5 V standby current or the board will not boot. Intel Server Board SE7320SP2 / SE7525GP2 User Guide 22

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Hardware Requirements
To avoid integration difficulties and possible board damage, your system must meet the
requirements outlined below. For a list of qualified components see the links under “
Additional
Information and Software
.”
Processor
Both the SE7320SP2 and SE7525GP2 server boards are designed to support one or two Intel®
Xeon™ processors utilizing an 800 MHz front side bus with frequencies starting at 2.8 GHz.
Previous generations of the Xeon processor are not supported for use on server boards SE7320SP2
and SE7525GP2. Both server boards are designed to provide up to 120A of current per processor.
Processors with higher current requirements are not supported.
For a complete list of supported processors, see the links under “
Additional Information and
Software
.”
Memory
The Server Boards SE7320SP2 and SE7525GP2 each provide four DDR266 / DDR333 DIMM
sites in two DIMM banks. The maximum memory capacity is 8GB for either DDR266 or DDR333
memory. Memory DIMM technologies supported are: 128Mb, 256Mb, 512Mb, 1Gb and 2Gb.
Memory sizing and configuration is guaranteed only for qualified DIMMs approved by Intel. For a
complete list of supported DIMMs, see the links under “
Additional Information and Software
.”
The minimum memory configuration is one DIMM, installed in DIMM socket 1B (the socket
farthest from the processors). However, for optimum performance and dual-channel interleave
operation, a minimum of two DIMMs should be installed. DIMMs on channel A are paired with
DIMMs on channel B to configure 2-way interleaving.
Both DIMMS in Bank 1 (DIMM1B and DIMM1A) must be populated before any DIMMs are
installed in Bank 2 (DIMM2B and DIMM2A). Bank 2 must be populated in pairs.
Both DIMMs in a bank must be identical (same manufacturer, CAS latency, number of rows,
columns and devices, timing parameters etc.). Although DIMMs within a bank must be identical,
the BIOS supports various DIMM sizes and configurations allowing the banks of memory to be
different.
The mixing of DDR266 and DDR333 memory is supported on the Server Boards SE7320SP2 and
SE7525GP2. However, when mixing DIMM types, DDR333 will be treated as DDR266.
Power Supply
A minimum of 600 Watts is required. Your supply must provide a minimum of 2.0 A of 5 V standby
current or the board will not boot.
Intel Server Board SE7320SP2 / SE7525GP2 User Guide
22