Intel SSR212MC2 Hardware Technical Product Specification - Page 3

Disclaimers - storage chassis

Page 3 highlights

Intel® Storage Server SSR212MC2 TPS Disclaimers Disclaimers Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® Storage Server SSR212MC2 may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel system boards contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel's own chassis are designed and tested to meet the intended thermal requirements of these components when the fully integrated system is used. It is the responsibility of the system integrator that chooses not to use Intel developed system building blocks to consult vendor datasheets and operating parameters to determine the amount of air flow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if components fail or the system board does not operate correctly when used outside any of their published operating or non-operating limits. Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation. *Other brands and names may be claimed as the property of others. Copyright © Intel Corporation 2003 - 2007. Revision 1.2 iii

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Intel® Storage Server SSR212MC2
TPS
Disclaimers
Revision 1.2
iii
Disclaimers
Information in this document is provided in connection with Intel
®
products. No license, express
or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel
assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to
sale and/or use of Intel products including liability or warranties relating to fitness for a particular
purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Intel products are not intended for use in medical, life saving, or life sustaining
applications. Intel may make changes to specifications and product descriptions at any time,
without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked
"reserved" or "undefined." Intel reserves these for future definition and shall have no
responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel® Storage Server SSR212MC2 may contain design defects or errors known as errata
that may cause the product to deviate from published specifications.
Current characterized
errata are available on request.
Intel system boards contain a number of high-density VLSI and power delivery components that
need adequate airflow to cool.
Intel’s own chassis are designed and tested to meet the
intended thermal requirements of these components when the fully integrated system is used. It
is the responsibility of the system integrator that chooses not to use Intel developed system
building blocks to consult vendor datasheets and operating parameters to determine the amount
of air flow required for their specific application and environmental conditions.
Intel Corporation
cannot be held responsible if components fail or the system board does not operate correctly
when used outside any of their published operating or non-operating limits.
Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others.
Copyright © Intel Corporation 2003 - 2007.