Lenovo ThinkPad 560E TP 560Z Technical Reference Manual - Page 130

equipment byte, RT/CMOS RAM, bytes

Page 130 highlights

DMA (continued) controller 1-4, 1-7 DSTN LCD (dual-scan supertwisted nematic liquid crystal display) 3-2 E EEPROM subsystem 1-3 electrical specifications 1-8 electromagnetic compatibility, specifications 1-8 enable NMI 2-18 equipment byte, RT/CMOS RAM configuration 2-25 error codes 2-32 external connector 2-9 F fault, overvoltage 1-11 G gate A20 2-29 H hard disk drive connector 2-8 fail initialization 2-23 hardware compatibility 2-31 heat output, specifications 1-8 height, system unit 1-8 humidity, specifications 1-8 I identifier, model 1-2 infrared subsystem 3-6 interrupt controller 1-3 NMI reset 2-27 IR subsystem 3-6 display 3-6 K key numbers 2-5 for the 84-key keyboard 2-5 for the 85-key keyboard 2-6 for the external numeric keypad 2-7 keyboard connector 2-4 ID 2-6 signals 2-4 keyboard/auxiliary device controller 1-4 keyboard/mouse connector 2-4 L LCD (liquid crystal display) 3-2 Li-ion (lithium-ion) battery pack, power supply 1-12 low and high base memory bytes, RT/CMOS RAM configuration 2-26 low and high expansion memory bytes, RT/CMOS RAM configuration 2-26 low and high usable memory bytes, RT/CMOS RAM configuration 2-26 M maximum altitude, specifications 1-8 measurements, system unit 1-8 memory performance 1-7 RAM 2-14 read 1-7 ROM 2-14 size miscompare 2-23 system memory map 2-15 microchannel bus adapter 1-4 microprocessor 1-3 alternative method of resetting 2-29 X-2 Index

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DMA
(continued)
controller
1-4, 1-7
DSTN LCD (dual-scan supertwisted
nematic liquid crystal display)
3-2
E
EEPROM subsystem
1-3
electrical specifications
1-8
electromagnetic compatibility,
specifications
1-8
enable NMI
2-18
equipment byte, RT/CMOS RAM
configuration
2-25
error codes
2-32
external connector
2-9
F
fault, overvoltage
1-11
G
gate A20
2-29
H
hard disk drive
connector
2-8
fail initialization
2-23
hardware compatibility
2-31
heat output, specifications
1-8
height, system unit
1-8
humidity, specifications
1-8
I
identifier, model
1-2
infrared subsystem
3-6
interrupt
controller
1-3
NMI reset
2-27
IR subsystem
3-6
display
3-6
K
key numbers
2-5
for the 84-key keyboard
2-5
for the 85-key keyboard
2-6
for the external numeric
keypad
2-7
keyboard
connector
2-4
ID
2-6
signals
2-4
keyboard/auxiliary device
controller
1-4
keyboard/mouse connector
2-4
L
LCD (liquid crystal display)
3-2
Li-ion (lithium-ion) battery pack,
power supply
1-12
low and high base memory bytes,
RT/CMOS RAM
configuration
2-26
low and high expansion memory
bytes, RT/CMOS RAM
configuration
2-26
low and high usable memory bytes,
RT/CMOS RAM
configuration
2-26
M
maximum altitude,
specifications
1-8
measurements, system unit
1-8
memory
performance
1-7
RAM
2-14
read
1-7
ROM
2-14
size miscompare
2-23
system memory map
2-15
microchannel
bus adapter
1-4
microprocessor
1-3
alternative method of
resetting
2-29
X-2
Index