Motorola HT750 Service Manual - Page 26
Chassis Assembly/Disassembly, Keypad, Display, and Keypad/PassPort/Option Board Disassembly
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3-6 Maintenance NOTE: At this point, if necessary, the DTMF Retrofit Kit Procedure can be performed. (See section 3.7.7 DTMF Retrofit Kit Procedure (Optional Upgrade Procedure) on page 3-12). 3.6.2 Chassis Assembly/Disassembly 1. If disassembly of the chassis or the main board is required, then use a TORX™ screwdriver with a T6 head to remove the four screws holding the main board to the chassis. Screws (4) Compliant Ground Contact Main Board Radio Chassis O-Ring Retaining Features Figure 3-5: Remove Main Board from Chassis CAUTION: Refer to the CMOS CAUTION in paragraph on page 3-2 before removing ! the main board. Be sure to use electrostatic discharge (ESD) protection when C a u t i o n handling circuit boards. 2. Lift the main board from the chassis (refer to Figure 3-5). 3. Remove the small O-ring retainers from their slots in the chassis. Note the alignment of the retainers for reassembly. 4. Remove the O-ring. 5. If required in disassembly, slide off the ground contact from the top corner boss of the radio chassis. 3.6.3 Keypad, Display, and Keypad/PassPort/Option Board Disassembly 1. If the disassembly of the keypad or the keypad printed circuit board, is required, lift the microphone flex circuit up, and carefully remove the microphone and its boot from the front cover pocket. (See Figure 3-6 on page 3-7). 2. Lay this flex circuit to one side.