ViewSonic PJ870 Service Manual - Page 63

°C/W

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PJ870 13,* EANIETER! ; Window surface quality (inside only) Opaque particle diameter (inside window surface only) Distance between apertured window and active area Window aperture total reflectivity Reflective type 90 Absorptivetype 7 Active area absorption coefficient Thermal impedance, active area to case Thermal impedence, window aperture to case Thermal impedance, case to thermal stud Electrical input power j A IT Ret,:irk, : N/A Note 9 N/A Note 7, 9 0 . 76 mm Note 7, 9 % Note % 10 11 33 35 % Note 11 0.7 °C/W Note 11 6.0 °C/W Note 10, 11 0.8 °C/W Note 11 0.95 w Note 11 Note 1 : Differential Mirror Position Differential mirror position refers to the geometric distortion of the array compared to an ideal array that locates the center of each mirror on the corresponding grid at 17.0 micron pitch. It is created by distortion in the optical performance of the semiconductor processing equipment used to define the array, and to a lesser extent by warpage and nonuniform etching in processing of the array. As an example, for the 8460 device, which has a resolution of 848 horizontal by 600 vertical pixels, if we define a coordinate system with origin at the upper left corner pixel (0,0), the pixel at the lower right hand corner will be at coordinates (14,399 +/- 1 micron, 10,183 +/- 1 micron). Similar tolerances apply within the array, e.g., the pixel in the 100th row and 100th column will be centered at coordinates (1700 +/- 1 micron, 1700 +/- 1 micron) assuming we define the corner pixel as being in the zeroth row and the zeroth column, centered at coordinates (0,0). ViewSonic Corporation - [ 7-3 ] Confidential - Do Not Copy

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PJ870
1
3
,*
E
ANIETER!
;
Window
surface
quality
(inside
only)
j
A
IT
Ret
,:irk
,
:
N/A
Note
9
Opaque
particle
diameter
(inside
window
surface
only)
N/A
7,
Note
9
Distance
between
apertured
window
and
active
area
.
0
76
mm
Note
7,
9
Window
aperture
total
reflectivity
Reflective
type
Absorptivetype
90
7
%
%
Note
10
11
Active
area
absorption
coefficient
33
35
%
Note
11
Thermal
impedance,
active
area
to
case
0.7
°C/W
Note
11
Thermal
impedence,
window
aperture
to
case
6.0
°C/W
Note
10,
11
Thermal
impedance,
case
to
thermal
stud
0.8
°C/W
Note
11
Electrical
input
power
0.95
w
Note
11
Note
1
:
Differential
Mirror
Position
Differential
mirror
position
refers
to
the
geometric
distortion
of
the
array
compared
to
an
ideal
array
that
locates
the
center
of
each
mirror
on
the
corresponding
grid
at
17.0
micron
pitch.
It
is
created
by
distortion
in
the
optical
performance
of
the
semiconductor
processing
equipment
used
to
define
the
array,
and
to
a
lesser
extent
by
warpage
and
nonuniform
etching
in
processing
of
the
array.
As
an
example,
for
the
8460
device,
which
has
a
resolution
of
848
horizontal
by
600
vertical
pixels,
if
we
define
a
coordinate
system
with
origin
at
the
upper
left
corner
pixel
(0,0),
the
pixel
at
the
lower
right
hand
corner
will
be
at
coordinates
(14,399
+/-
1
micron,
10,183
+/-
1
micron).
Similar
tolerances
apply
within
the
array,
e.g.,
the
pixel
in
the
100th
row
and
100th
column
will
be
centered
at
coordinates
(1700
+/-
1
micron,
1700
+/-
1
micron)
assuming
we
define
the
corner
pixel
as
being
in
the
zeroth
row
and
the
zeroth
column,
centered
at
coordinates
(0,0).
[
7-3
]
ViewSonic
Corporation
-
Confidential
-
Do
Not
Copy